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Semi-conductor adhesive and preparation method thereof

A technology of semiconductors and rubber materials, applied in the direction of adhesives, epoxy resin glue, adhesive types, etc., can solve the problems of poor shielding reliability and safety, achieve good electrostatic shielding effect, low loss, and simple process

Active Publication Date: 2008-07-02
XIAN XIDIAN TRANSFORMER
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The object of the present invention is to provide a semiconductor glue and its preparation method, which solves the technical problem of poor reliability and safety of shielding in the background art

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment

[0052] Semiconductor glue of the present invention, by weight percentage, specific embodiment is as follows:

example 1    example 2    example 3    example 4

[0053] Example 1 Example 2 Example 3 Example 4 Example 5 Example 6

[0054] Compound 55 65 57 62 58 63

[0055] Packing 41 31 40 35 40 33

[0056] Low temperature curing agent 44 3 3 24

[0057] Sizing material of the present invention, by weight percentage, specific embodiment is as follows:

[0058] Example 1 Example 2 Example 3 Example 4

[0059] Epoxy glue 79 81 80 79

[0060] Hardener 8 8 7 9

[0061] Toughener 13 11 13 12.

[0062] Filler of the present invention, by weight percentage, specific embodiment is as follows:

[0063] Example 1 Example 2 Example 3 Example 4

[0064] Graphite 61 58 62 59

[0065] Kaolin 39 42 38 41.

[0066] The epoxy glue of the semiconductor glue of the present invention is preferably E-44 epoxy resin, and E-42 epoxy resin or E-51 epoxy resin can also be used. The curing agent can be selected according to the epoxy glue and curing temperature. Specifically, a medium temperature curing ag...

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Abstract

The invention relates to a semiconductor adhesive used for electric apparatuses, which contains, by weight percentage, an adhesive material 55 to 65% which contains an epoxy adhesive 79 to 81%, a curing agent 7 to 9% and a toughening agent 11 to 13%; a packing material 31 to 41% which contains graphite 58 to 62% and kaolin 38 to 42%; and a low-temperature curing agent 2 to 4%. The epoxy adhesive is heated to fluid by a 50-60-DEG C oven; the fluidic epoxy adhesive is added into a beaker and then in a constant-temperature water bath at 50-60 DEG C; the curing agent, the toughening agent and a diluting agent are sequentially added into the beaker while stirring until stirring uniformly; and the packing material is added and stirred uniformly. The invention solves the technical problems of the prior arts such as poor shielding reliability and poor safety. The invention has the advantages of simple implementation process and high production efficiency, and can be used for electrostatic shielding or for formation of semiconductor layer.

Description

technical field [0001] The invention relates to a bonding glue and a preparation method thereof, in particular to a semiconductor glue used in electrical appliances and a preparation method thereof, and is especially suitable for electrostatic shielding of transformers, reactors, current transformers and the like. Background technique [0002] At present, the fastening, external binding and shielding of iron cores such as transformers, reactors, and current transformers are to bind non-weft tapes outside the iron core columns, and then wrap the electrostatic screen made of metal foil on the outside. The process is relatively complicated and the production efficiency is low. Due to the complex shielding structure and large volume, the inner diameter of the winding increases and more copper is consumed. Moreover, the metal foil is very thin and easy to break, and a potential suspension will be formed at the break, resulting in discharge. However, the fracture of the metal fo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/02C09J177/00
Inventor 李强陈敏懋
Owner XIAN XIDIAN TRANSFORMER
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