98results about How to "Reliable shielding" patented technology

The present invention relates to a method of manufacturing an electrode substrate that has a base substrate made of glass having a strain point of 520° C. or higher, a transparent conductive layer formed on the base substrate, a metal wiring layer, and an insulating layer made of low-melting glass that covers the metal wiring layer, the metal wiring layer and the insulating layer being provided on the transparent conductive layer, the method including at least the steps of providing paste that forms a base material of the low-melting glass so as to cover the metal wiring layer; and forming the insulating layer by sintering the paste by means of a heat treatment.

A radiation detecting apparatus includes a radiation conversion panel for detecting radiation that has passed through a subject and converting the detected radiation into radiation image information, and a casing for storing the radiation conversion panel as a roll when the subject is not being irradiated with radiation. When the subject is irradiated with radiation, the radiation conversion panel stored as a roll in the casing is unrolled and pulled out of the casing, and the radiation conversion panel is extended flatwise against the subject.

An electromagnetic interference (EMI) shielding enclosure (1) for a portable electronic device includes a first layer (10) and a second layer (12). The first layer is adjoins an underside of the second layer. The first layer includes an interface layer (101) and an inside layer (102) in which a great number of metal particles (1020) or thin metal plates are embedded. The second layer is joined with the interface layer of the first layer. Because the second layer and the interface layer are made of the same plastic material, very strong adhesion therebetween can be obtained. Moreover, the second layer is outside the first layer, the second layer protects the inside layer from impact and wear. As a result, EMI generated by the portable electronic device inside the EMI shielding enclosure reliably shielded over a long period of time. The present invention also discloses a method for making the shielding enclosure.

A shield box is composed of metal-made upper box and lower box, which are combined with each other. The shield box houses therein a plurality of shield connectors interconnecting shield wires, and thereby electromagnetically shields entirety of the shield connectors and the shield wires. On an upper surface of a lower surface plate of the lower box, clamp fittings capable of restraining the respective shield connectors in axial, axial rotation, left-and-right and up-and-down directions thereof are provided. On opposite surfaces of the upper and lower boxes, press fittings are provided to sandwich shield terminal portions from upper and lower sides and conduct the shield terminal portions to the upper and lower boxes when the upper and lower boxes are matched with each other. The shield terminal portions, which are electrically connected to shield conductors of respective shield wires and are exposed to both ends of the respective shield connectors, are grounded.

In an ignition coil having a high-voltage terminal and a spring for electrically connecting the high-voltage terminal to a spark plug, a contact segment of the spring, which is directed towards the spark plug, has an outer circumference that is reduced in comparison with an outer circumference of further segments of the spring. The spark plug has a contact region for contacting with the spring of the ignition coil, which contact region has a recess surrounded by a closed, annular wall region for receiving the contact segment of the spring of the ignition coil.

The invention relates to an insulation insert that can be inserted into a plug-in connector housing (11) of a plug-in connector (10), wherein in the insulation insert (1), at least one contacting element for electrically contacting a conductor core of a cable (12) to be connected may be provided, wherein the insulation insert (1) is provided in one area with a conductive coating, wherein the coated area forms a shielding element (3) that can be electrically contacted with a shielding braid of the cable (12) to be connected and at the same time with the plug-in connector housing (11), and wherein the insulation insert (1) and the shielding element (3) are integrally formed in.

The invention relates to a semiconductor adhesive used for electric apparatuses, which contains, by weight percentage, an adhesive material 55 to 65% which contains an epoxy adhesive 79 to 81%, a curing agent 7 to 9% and a toughening agent 11 to 13%; a packing material 31 to 41% which contains graphite 58 to 62% and kaolin 38 to 42%; and a low-temperature curing agent 2 to 4%. The epoxy adhesive is heated to fluid by a 50-60-DEG C oven; the fluidic epoxy adhesive is added into a beaker and then in a constant-temperature water bath at 50-60 DEG C; the curing agent, the toughening agent and a diluting agent are sequentially added into the beaker while stirring until stirring uniformly; and the packing material is added and stirred uniformly. The invention solves the technical problems of the prior arts such as poor shielding reliability and poor safety. The invention has the advantages of simple implementation process and high production efficiency, and can be used for electrostatic shielding or for formation of semiconductor layer.

An electro-optical device includes semiconductor layers disposed between a first substrate and an electro-optical layer. The semiconductor layers are provided at positions corresponding to crossover regions of scanning lines and data lines. Island light shielding films are disposed between the second substrate and the electro-optical layer. The island light shielding films are isolated from each other and at least partially overlapping a corresponding one of the semiconductor layers in plan view.

A shielded case includes a plurality of walls. At least one of the walls is formed by at least first and second separate sections which abut one another along an interface. A depression is formed in at least one of the first and second sections so as to cause at least one of said sections to expand toward the other of section thereby pressure-welding said first and second sections to one another along at least part of said interface.

A universal motor (2) includes at least two carbon brushes (36) contacting the commutator (14), a ventilation device (12) for producing a cooling flow (K), and a dust protection arrangement for preventing penetration of material particles (M) into the commutation region (34) and including at least one guide member (26) that provides for delivering of the material particles (M) in the cooling flow (K), with the at least one guide member (26) having a smooth concave guide surface (28) located between the two carbon brushes (36) and extending adjacent to an outer surface (30) of the commutator (14) and toward a suction opening (22) connected with the cooling flow path (24).

A semiconductor layer of a TFT is continuously formed from an inside of an open hole portion overlapping with an intersection up to an outside of the open hole portion and includes a first source/drain area electrically connected to a surface portion of the data line exposed to a bottom surface of the open hole portion, a channel area disposed on a side wall of the open hole portion, and a second source/drain area formed outside the open hole portion and electrically connected to the pixel electrode. The gate electrode of the TFT is formed inside the open hole portion so as to overlap with at least the channel area and is electrically connected to a scanning line.

The invention provides a differential relay protection communication device based on 5G communication, a system and a method. The device comprises an electrical information acquisition module, a 5G communication module and a trip logic processing module, wherein the electrical information acquisition module is used for acquiring operation information of electrical equipment in real time; the 5G communication module is used for receiving the operation information of the electrical equipment that is collected by the electrical information acquisition module and realizing the operation information intercommunication between different electrical equipment; and the trip logic processing module is used for receiving the operation information of the electrical equipment that is transmitted by the5G communication module, judging the operation state of the power grid, and making a normal operation or switch trip command. According to the communication device, the system and the method, no conventional propagation medium is required, the cost of the device is greatly reduced, and the transmission rate is greatly improved, thus realizing real multi-node cooperative transmission and fault judgment and improving the reliability and stability of communication.

A light shielding structure of an optical device, includes a plurality of optical elements arranged at different positions in an optical axis direction. The light shielding structure includes at least one annular light shielding member positioned between two of the optical elements to shield harmful light, and a plurality of springs held between the two optical elements to be resiliently deformable in the optical axis direction. The springs include at least two springs, one of which is held between one of the two optical elements and the annular light shielding member while the other of the two springs is held between the other of the two optical elements and the annular light shielding member. The annular light shielding member is supported between the two optical elements in a balanced state between the spring forces of the plurality of springs.