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Semiconductor device and method for manufacturing semiconductor device

A semiconductor and conductor technology, applied in the field of three-dimensional semiconductor devices and the manufacture of the three-dimensional semiconductor devices, can solve the problems of reduced operational reliability of three-dimensional semiconductor memory devices and the like

Pending Publication Date: 2022-05-06
SK HYNIX INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the number of stacked memory cells increases, the operational reliability of a three-dimensional semiconductor memory device may decrease

Method used

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  • Semiconductor device and method for manufacturing semiconductor device
  • Semiconductor device and method for manufacturing semiconductor device
  • Semiconductor device and method for manufacturing semiconductor device

Examples

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Embodiment Construction

[0021] The specific structural or functional descriptions of examples of implementations according to the concepts disclosed in this specification are only shown to describe examples of implementations according to the concepts, and examples of implementations according to the concepts can be realized in various forms, But these descriptions are not limited to the examples of implementation described in this specification.

[0022] Figure 1A is a plan view illustrating a semiconductor device according to an embodiment of the present disclosure. Figure 1B is along Figure 1A A cross-sectional view taken along the line A1-A1'. Figure 1C is a plan view showing a semiconductor layer and a via gate of a semiconductor device according to an embodiment of the present disclosure. Figure 1D yes Figure 1B A magnified view of region A of . Figure 1E yes Figure 1B A magnified view of region B of .

[0023] refer to Figure 1A to Figure 1C , the semiconductor device may includ...

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PUM

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Abstract

The invention relates to a semiconductor device and a manufacturing method of the semiconductor device. A semiconductor device includes: a laminate including a conductive pattern and an insulating pattern; a cell plug that passes through the laminated body; a semiconductor layer; a peripheral transistor disposed on the semiconductor layer; a first conductor coupling the peripheral transistor to the cell plug; a second conductor coupled to the conductive pattern; a through plug coupled to the second conductor; and a pass gate surrounding the pass plug, where the pass gate is disposed at substantially the same height as the semiconductor layer.

Description

technical field [0001] Various embodiments of the present invention relate generally to a semiconductor device and a method of manufacturing the same, and more particularly, to a three-dimensional semiconductor device and a method of manufacturing the same. Background technique [0002] A semiconductor memory device may include memory cells that store data. Since a three-dimensional semiconductor memory device includes three-dimensionally arranged memory cells, the number of memory cells per unit area of ​​a substrate may increase. [0003] The number of memory cells stacked on each other can be increased to improve the integration density of a three-dimensional semiconductor memory device. However, as the number of stacked memory cells increases, the operational reliability of a three-dimensional semiconductor memory device may decrease. Contents of the invention [0004] Various embodiments relate to a semiconductor device having a reduced size and a method of manufact...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/538H01L27/11568H01L27/11578H01L21/768H10B41/35H10B43/40H10B41/10H10B41/20H10B43/10H10B43/20H10B43/27H10B43/30H10B43/35H10B43/50
CPCH01L23/5386H01L21/76897H10B43/20H10B43/30H01L2224/08145H01L24/80H01L24/08H01L2224/80895H01L2224/80896H01L2224/80357H01L2224/08058H10B43/40H10B43/35H10B43/27H01L2224/05556H01L2924/00014H01L25/0657H01L24/05H10B43/50H10B41/35H10B41/10H10B41/20H10B43/10
Inventor 李南宰
Owner SK HYNIX INC