Liquid-cooled heat dissipation module and electronic device with same

Abstract

The invention provides a liquid-cooled heat dissipation module and an electronic device with the liquid-cooled heat dissipation module. The liquid-cooled heat dissipation module and the electronic device are used for solving the problems that an existing liquid-cooled heat dissipation system is large in component number, large in occupied space and the like. Comprising a shell, which is provided with a first chamber and a second chamber which are communicated through a communication port and a backflow port; and the pump is positioned in the shell and is aligned to the communicating port, the pump is provided with a stator for driving an impeller to rotate, so that a working solution flows through the communicating port, the stator and the impeller from the first cavity, flows to the backflow port in the second cavity, and flows back to the first cavity after passing through the backflow port.

Description

technical field [0001] The invention relates to a heat dissipation module and an electronic device, in particular to a liquid-cooled heat dissipation module that can help the electronic device maintain a proper working temperature and an electronic device with the liquid-cooled heat dissipation module. Background technique [0002] Please refer to figure 1 , which is an existing liquid-cooled heat dissipation system 9 , and the existing liquid-cooled heat dissipation system 9 has a heat absorption unit 91 , a heat dissipation unit 92 , a pump 93 and a pipe assembly 94 . The heat absorbing unit 91 can be attached to the heat source Z of the electronic device. The pipe assembly 94 is connected to the pump 93 and the heat absorbing unit 91 by a pipe 941 , and connected to the pump 93 and the heat dissipation unit 92 by a pipe 942 , and then a tube 943 communicates the heat absorbing unit 91 and the heat dissipating unit 92 . [0003] According to the aforementioned structure,...

AI Technical Summary

Problems solved by technology

[0004] However, the existing liquid-cooled heat dissipation system 9 has a large number of components, and due to the need for assembly and combination of the components, a certain installation space must be occupied, making it difficult to reduce the space required for the overall liquid-cooled heat dissipation system 9 , for light and thin electronic devices, it often encounters the problem of difficulty in setting up space configuration

Moreover, if the pipe fittings 94 of the existing liquid-cooled heat dissipation system 9 are not tightly assembled with the corresponding components, the internal working fluid may leak, so careful assembly is required, which is relatively labor-intensive and time-consuming. Moreover, the more components in the pipe fitting set 94, the higher the possibility of leakage; in addition, after a period of use, the pipe fitting set 94 will also have problems such as evaporation of working fluid and aging and cracking of pipe fittings, so that the service life is shorter Or more often need inspection and maintenance

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