Semiconductor wafer silicon wafer slicing device

Abstract

The invention discloses a semiconductor wafer silicon wafer separating device which comprises a flushing box, a placing grid is slidably connected in the flushing box, the left end and the right end of the placing grid are each fixedly connected with a fixed sliding block, the left inner side wall and the right inner side wall of the flushing box are each provided with a fixed sliding groove, and the left inner side wall and the right inner side wall of the flushing box are each provided with a fixed sliding block. The top end of the flushing tank is fixedly connected with a cleaning water tank, the bottom wall of the cleaning water tank is fixedly connected with a plurality of connecting pipes penetrating through the cleaning water tank, the other end of each connecting pipe is fixedly connected with a spray head, a piece separating device is arranged in the cleaning water tank, and a cleaning device is further arranged in the flushing tank. According to the slicing device, a semiconductor wafer silicon wafer can be cleaned while slicing is conducted, powder and chippings left on the semiconductor wafer silicon wafer can be cleaned away, and therefore the slicing efficiency is improved, meanwhile, the ultrasonic generation structure is further arranged, the cleaning effect can be further improved, and use of the slicing device is facilitated.

Description

technical field [0001] The invention relates to the field of semiconductor wafer silicon wafers, in particular to a semiconductor wafer silicon wafer slicing device. Background technique [0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuits, and its raw material is silicon. High-purity polycrystalline silicon is dissolved and mixed with silicon crystal seeds, and then slowly pulled out to form cylindrical single crystal silicon. After the silicon ingot is ground, polished, and sliced, it forms a silicon wafer, that is, a wafer. After the wafer is prepared, it needs to be diced and cut. [0003] Most of the existing semiconductor wafer slices are cut with wire saws suitable for ultra-thin diamonds, so a certain amount of semiconductor wafer powder and debris will remain on the semiconductor wafer silicon wafers during cutting, while The existing slicing device lacks a cleaning device, and it is difficult to remove the remaining debris. There...

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Problems solved by technology

[0004] The purpose of the present invention is in order to solve the shortcoming that exists in the prior art, as: can produce certain semiconductor wafer silicon chip powder and debris to remain on the semiconductor wafer silicon chip when cutting, and in existing slicing device The lack of a cleaning device makes it difficult to remove the remaining debris. It needs to be cleaned after the slicing is completed, which reduces the slicing efficiency of the device and is not conducive to the use of the slicing device. A semiconductor wafer silicon wafer is proposed Fragmentation device

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