Electronic tag chip packaging process

Abstract

The invention discloses an electronic tag chip packaging technology, and relates to the technical field of packaging. The device comprises a device body, an electric telescopic device is fixed to the top of the inner wall of the device body, a heating and pressing device is fixed to the bottom of an output shaft of the electric telescopic device, a conveying belt is arranged below the heating and pressing device, and a bubble removing device is arranged on the outer side of the output shaft of the electric telescopic device. The bubble removing device comprises a fixing frame. Through cooperation of the electric telescopic device and the fixing frame, an output shaft of the electric telescopic device drives the fixing frame to move downwards, and under cooperation of a hinge rod and a pressing roller, the hinge rod drives the pressing roller to flatten a plastic part and an electronic tag chip from the middle to the two sides; therefore, the purpose of extruding and discharging the bubbles in the plastic part and the electronic tag chip is achieved, and the problem that the bubbles affect the service life of the electronic tag chip is avoided.

Description

technical field [0001] The invention relates to the technical field of packaging, in particular to an electronic label chip packaging process. Background technique [0002] Electronic tags are widely used and can be used in various environments. Electronic tags can be automatically identified by radio frequency signals and obtain relevant data. Electronic tags are generally packaged in boxes made of plastic materials. Electronic label packaging equipment will be used for electronic label packaging. [0003] The existing electronic label packaging equipment will generate bubbles during the process of packaging electronic labels, and the residual air inside the generated bubbles will expand under high temperature conditions and cause damage to the sealing shell, thus affecting the use of electronic label chips Therefore, we propose an electronic label chip packaging equipment and packaging process. Contents of the invention [0004] Aiming at the deficiencies of the prior a...

AI Technical Summary

Problems solved by technology

[0003]The existing electronic label packaging equipment will produce bubbles during the process of packaging electronic labels, and the residual air inside the generated bubbles will be heated and expand under high temperature environment. The shell used for sealing is damaged, which affects the service life of the electronic label chip. Therefore, we propose an electronic label chip packaging equipment and packaging process

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