Rapid heat dissipation device for computer mainframe box

Abstract

The invention relates to the technical field of computer cases, and discloses a computer case rapid heat dissipation device which comprises a bottom plate, a case body is arranged on the upper surface of the bottom plate, third fixing plates are arranged on the left side and the right side of the upper surface of the bottom plate, the third fixing plates are rotationally connected with first rotating shafts, and first bevel gears are arranged at the two ends of the first rotating shafts; the upper portion of the lead screw is in threaded connection with the lower portion of a threaded sleeve. A fixing base is arranged at the upper end of the threaded sleeve and rotationally connected with a driving wheel. Driven wheels matched with the driving wheel are arranged on the front side and the rear side of the driving wheel. A second rotating shaft is arranged between the driven wheels on the left side and the right side. The end of the second rotating shaft is rotationally connected with a fourth fixing plate, and the upper end of the fourth fixing plate is fixedly connected with a cover plate. According to the rapid heat dissipation device for the computer mainframe box, on the premise that the heat dissipation effect is guaranteed, the mute and dustproof effects of the computer mainframe box can be guaranteed to the maximum extent.

Description

technical field [0001] The invention relates to the technical field of computer chassis, in particular to a fast cooling device for a computer main chassis. Background technique [0002] The main computer chassis refers to the main body part of the computer except the input and output devices. It is also a control box for placing the main board and other main components. Usually includes CPU, memory, motherboard, hard disk, optical drive, power supply, chassis, cooling system, and other input and output controllers and interfaces. [0003] During the working process of the computer, the internal components will generate heat, and heat dissipation is required at this time. However, the heat generated by the components of the computer is proportional to the load of the computer. When the computer is running under a light load, the computer generates less heat. The computer generates a lot of heat when it is running under a heavy load. However, the host itself of the computer...

AI Technical Summary

Problems solved by technology

[0003] During the working process of the computer, the internal components will generate heat, and heat dissipation is required at this time. However, the heat generated by the components of the computer is proportional to the load of the computer. When the computer is running under a light load, the computer generates less heat. The computer generates a lot of heat when it is running under a heavy load. However, the host itself of the computer needs to consider the problem of dustproof and quiet. Under the premise, try to ensure quietness and dustproof as much as possible. However, the effect of the current computer cooling device is fixed and cannot be adjusted in a targeted manner. Therefore, it needs to be improved.

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