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A to UV device packaging structure

A device packaging and ultraviolet technology, which is applied in the direction of semiconductor devices, electric solid devices, electrical components, etc., can solve the problems of inability to realize 360-degree deep ultraviolet signal reception, achieve the effect of concentrating light and simplifying the system structure

Active Publication Date: 2022-07-12
ZHIXIN SEMICON (HANGZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, at present, the deep ultraviolet light-emitting diode emitting device and the deep ultraviolet signal receiving device are designed as separate devices, and the receiving signal angle of a single deep ultraviolet signal receiving device is 180 degrees, which cannot realize 360 ​​degree deep ultraviolet signal reception

Method used

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Embodiment Construction

[0027] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0028] The purpose of the present invention is to provide a TO UV device packaging structure, in order to solve the existing TO UV device as a separate design, it is impossible to realize the technology that a single TO UV device can both emit deep UV signals and receive deep UV signals, and has a complex structure question.

[0029] In order to make the above objects, features and advantages of the present invention more clearly und...

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Abstract

The invention discloses a TO UV device packaging structure, which relates to the technical field of semiconductor packaging. A ceramic module is mounted on a base, a front pad and a bottom pad are respectively mounted on the upper and lower end faces of the ceramic module, and a plurality of side pads surround the ceramic module. It is installed on the outer side wall of the device, and different side pads can be connected to different parts corresponding to the front pads. It passes through the base, the bottom pad and the ceramic module in sequence, and conducts with different parts of the front pad. Different parts of the front pad can also conduct the deep ultraviolet emitting chip and the detection chip through the side pad respectively. The detection chip can receive the signal sent by the deep ultraviolet emission chip. The TO UV device packaging structure can meet the technical requirements of optical communication that a single device has both deep UV emission and 360-degree reception.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a packaging structure of a TO ultraviolet device. Background technique [0002] Deep ultraviolet light-emitting diodes (UVC LEDs) have the advantages of high reliability, long life, fast response, low power consumption, environmental protection, no pollution and small size, and are widely used in ultraviolet light communication, sterilization and other fields. Its ultraviolet light communication has the unique advantages of flexibility, low eavesdropping, omnidirectional and non-line-of-sight communication. Ultraviolet photons are mainly used in important communication fields such as short distance and high confidentiality. The scattering effect of deep ultraviolet photons in the atmosphere makes ultraviolet light The direction of energy transmission has changed, which also laid the communication foundation for ultraviolet light communication. However, at present...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/58H01L33/62H01L31/02H01L25/16
CPCH01L33/62H01L33/58H01L31/02005H01L25/167
Inventor 闫志超黄小辉刘建青
Owner ZHIXIN SEMICON (HANGZHOU) CO LTD
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