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Drum-type brush ball laying equipment

A roller-type, ball-laying technology, applied in the field of BGA ball planting, can solve problems such as ball jamming, scratches, and missing balls

Pending Publication Date: 2022-05-27
SHANGHAI TECHSENSE CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the existence of gaps, solder balls often cause scratches and ball jams when laying balls, and there may also be missing balls during the process of laying balls

Method used

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  • Drum-type brush ball laying equipment
  • Drum-type brush ball laying equipment
  • Drum-type brush ball laying equipment

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Experimental program
Comparison scheme
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Embodiment Construction

[0032] The preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings to further illustrate the present invention.

[0033] First, combine Figures 1~4 The roller-type brush ball-laying equipment according to the embodiment of the present invention is described, which is used for ball-laying treatment in the BGA ball-mounting process, and has a wide range of application scenarios.

[0034] like Figure 1~2 , 4, the roller brush ball laying equipment of the embodiment of the present invention has a pair of bottom plates 1, a ball laying fixture 2 and a ball laying module.

[0035] Specifically, as Figure 1~2 , 4, in this embodiment, a pair of bottom plates 1 are symmetrically arranged to play a supporting role, a ball laying fixture 2 is arranged on a pair of bottom plates 1, and a number of ball mounting holes 21 are provided on the ball laying fixture 2 , a plurality of ball-loading holes 21 are used for pl...

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PUM

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Abstract

The invention discloses drum-type brush ball laying equipment, which comprises a pair of bottom plates, a pair of ball laying devices, a pair of ball laying devices and a pair of ball laying devices, the ball laying jig is arranged on the pair of bottom plates, and a plurality of ball containing holes are formed in the ball laying jig; and the ball laying module is arranged on the pair of bottom plates and is used for laying balls. Compared with the prior art, the brushes on the two rollers are used for brushing the solder balls into the hole sites of the ball laying jig, and the problems that in the existing BGA ball mounting process, thin scrapers at the two ends of the front face of the ball laying face of a ball box often cause scratching, ball clamping and ball lacking are solved.

Description

technical field [0001] The invention relates to the technical field of BGA ball-planting, in particular to a roller-type brush ball-laying device. Background technique [0002] BGA ball grid array packaging technology is an advanced high-performance packaging technology developed after the 1990s. Its outer leads are solder balls or solder bumps, which are distributed in an array on the bottom plane of the packaging substrate. The ball mounting process includes printing and mounting. The core technology carried is ball planting. The mainstream of ball mounting technology is the needle transfer mode using a jig and the stencil mounting mode. Bumping is used to precisely place solder balls on the plane of the substrate on which the flux has been printed. The present invention is mainly aimed at the ball-laying method in the ball-planting process. [0003] The current ball box laying technology is to block the solder balls by the thin scrapers at the front and rear ends of t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K3/06H01L21/67
CPCB23K3/0623H01L24/81H01L2224/8138Y02P70/50
Inventor 梁猛林海涛赵凯刘越邵嘉裕黄军鹏
Owner SHANGHAI TECHSENSE CO LTD