Method for reducing copper nodules on surface of high-temperature and high-ductility copper foil

Abstract

The invention discloses a method for reducing copper nodules on the surface of a high-temperature and high-ductility copper foil. The method comprises the following steps: S1, preparing a copper sulfate solution; s2, filtering the copper sulfate solution; s3, hydroxyethyl cellulose is added into the copper sulfate solution; and S4, electrolyzing the copper foil by using a crude foil system. According to the method, a copper foil additive, namely hydroxyethyl cellulose, is added into an electrolyte, and the problem that copper nodules easily appear in the electrolytic production process of the traditional high-temperature and high-ductility copper foil can be solved by utilizing the salt solubility of the hydroxyethyl cellulose to the electrolyte at high temperature through a reasonable concentration ratio; therefore, the purposes that various ions in the copper sulfate solution are good in stability and copper nodules generated on the surface of the electrolytic copper foil are reduced are achieved.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil, in particular to a method for reducing copper nodules on the surface of high-temperature high-elongation copper foil. Background technique [0002] Electrolytic copper foil is an important material for the manufacture of copper clad laminates (CCL), printed circuit boards (PCB), and lithium-ion batteries. In the rapid development of today's electronic information industry, electrolytic copper foil is called the "neural network" of electronic product signal and power transmission and communication. Since 2002, the production value of printed circuit boards in my country has entered the third place in the world, and as the substrate material of PCB - copper clad laminate has also become the third largest producer in the world. As a result, my country's electrolytic copper foil industry has developed by leaps and bounds in recent years. [0003] It is precisely because of the rapi...

AI Technical Summary

Problems solved by technology

[0003] It is precisely because of the rapid development of electrolytic copper foil that the demand for copper foil quality is getting higher and higher, especially the demand for high-temperature and high-ductility copper foil. In the traditional electrolytic process, the electroplating additive is gelatin. Poor lumpiness has always restricted the development of high-quality copper foil, making traditional high-temperature high-ductility copper foil very prone to copper bumps in the process of electrolytic production

Images