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Low-viscosity two-component heat-conducting pouring sealant and preparation method thereof
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A thermally conductive potting, two-component technology, used in adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problems of high brittleness, easy cracking, insufficient toughness, etc., to reduce viscosity and equipment investment. Small, easy-to-use effects
Pending Publication Date: 2022-06-03
QINGDAO ZHUOYOU NEW MATERIAL
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Abstract
Description
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Problems solved by technology
Its disadvantages are high brittleness, insufficient toughness, certain internal stress during curing, and cracks are easy to occur after curing; sil
Method used
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Embodiment 1
A low-viscosity two-component addition type thermally conductive potting compound comprises the following components by weight:
Component A includes the following raw materials by mass fraction:
100 parts of 200 viscosity vinyl silicone oil;
60 parts of 5~10μm amorphous silicon powder;
40 parts of 10~20μm amorphous aluminum hydroxide;
30~40μm spherical alumina 40 parts;
20 parts of methyl silicone oil;
0.1 part of octyltriethoxysiloxane;
0.1 part of ethyl silicate;
0.1 part of chloroplatinic acid;
Component B includes the following raw materials by mass fraction:
100 parts of 200 viscosity vinyl silicone oil;
60 parts of 5~10μm amorphous silicon powder;
40 parts of 10~20μm amorphous aluminum hydroxide;
40 parts of 30~40μm spherical alumina;
10 parts of methyl silicone oil;
10 parts of 0.8% hydrogen-containing silicone oil;
0.1 part of octyltriethoxysiloxane;
0.1 part of ethyl silicate;
Ethynylcyclohexanol 0.02 part.
[0025] The preparation pr...
Embodiment 2
A low-viscosity two-component addition type thermally conductive potting compound comprises the following components by weight:
Component A includes the following raw materials by mass fraction:
100 parts of 50 viscosity vinyl silicone oil;
80 parts of 0.5~2μm amorphous alumina;
5~10μm spherical alumina 150 parts;
50 parts of 10~20μm amorphous aluminum hydroxide;
30~40μm spherical alumina 140 parts;
30 parts of methyl silicone oil;
Octyltriethoxysiloxane 0.2 part
0.2 part of ethyl silicate
0.1 part of chloroplatinic acid;
Component B includes the following raw materials by mass fraction:
100 parts of 50 viscosity vinyl silicone oil;
50 parts of 0.5~2μm amorphous alumina;
5~10μm spherical alumina 150 parts
50 parts of 10~20μm amorphous aluminum hydroxide;
30~40μm spherical alumina 140 parts;
10 parts of methyl silicone oil;
20 parts of 0.15% hydrogen-containing silicone oil;
Octyltriethoxysiloxane 0.2 part
0.2 part of ethyl silicate
Ethynylc...
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Abstract
The invention discloses a low-viscosity two-component heat-conducting pouring sealant and a preparation method thereof. The low-viscosity two-component heat-conducting pouring sealant is prepared from 100 parts of vinyl silicone oil, 10-30 parts of a cross-linking agent, 0.01-0.1 part of a catalyst, 0.001-0.06 part of an inhibitor, 200-600 parts of heat-conducting filler, 10-30 parts of a plasticizer and 0.01-1 part of a silane coupling agent. The preparation method comprises the following steps: preparing the base adhesive, preparing the component A and preparing the component B. The preparation method comprises the following steps: preparing the base adhesive, preparing the component A and preparing the component B. The product prepared by matching the fillers with different types, particle sizes and shapes and treating the fillers with the silane coupling agent has lower viscosity and higher fluidity, and has excellent high and low temperature resistance, excellent weather resistance, excellent radiation resistance and excellent dielectric property after being cured.
Description
technical field [0001] The invention relates to a low-viscosity two-component addition type heat-conducting potting glue and a preparation method, and belongs to the technical field of heat-conducting potting glue. Background technique [0002] Thermally conductive potting glue is mainly used for bonding, sealing, potting and coating of electronic components. The potting glue is in a liquid state before curing, and has fluidity. The viscosity of the glue varies according to the material, performance and production process of the product. After curing, it can play a good role in thermal conductivity, insulation, waterproof and moisture-proof, dust-proof, The functions of confidentiality, anti-corrosion, temperature resistance and shock resistance. At present, the commonly used electronic potting materials on the market mainly include polyurethane, epoxy resin and silicone rubber. Polyurethane material has good low temperature resistance, weather resistance, low viscosity, g...
Claims
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Application Information
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