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Adsorption system and adsorption method for large-warping-degree sample

An adsorption system and large warpage technology, applied in the field of adsorption, can solve the problems of smooth surface, adverse effects of optical measurement, inability to adsorb and fix high-warpage wafers, etc., and achieve a simple structure, which is conducive to subsequent processing or measurement Effect

Pending Publication Date: 2022-06-03
RAINTREE SCI INSTR SHANGHAI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] 1) Vacuum adsorption type, which cannot absorb and fix high warpage wafers;
[0005] 2) ESC (Electro Static Chuck, electrostatic chuck) method (that is, electric suction type), which is also unable to absorb and fix high-warpage wafers;
[0006] 3) Clamping type, this method can fix the wafer, but it cannot make the surface smooth, which has a great adverse effect on the subsequent optical measurement

Method used

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  • Adsorption system and adsorption method for large-warping-degree sample

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Embodiment Construction

[0025] The present invention will be described in more detail below with reference to the accompanying drawings, in which preferred embodiments of the invention are shown, and it should be understood that those skilled in the art can modify the invention described herein and still achieve the advantageous effects of the invention. Therefore, the following description should be construed as widely known to those skilled in the art and not as a limitation of the present invention.

[0026] Specific structural and functional details disclosed herein are merely representative and for purposes of describing example embodiments of the present application. The application may, however, be embodied in many alternative forms and should not be construed as limited only to the embodiments set forth herein.

[0027] The terminology used herein is for the purpose of describing specific embodiments only and is not intended to limit the exemplary embodiments. As used herein, the singular fo...

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Abstract

The invention provides an adsorption system and an adsorption method for a large-warping-degree sample. The adsorption system comprises a suction cup and a flexible sealing device, the flexible sealing device is fixed on the suction cup and is used for forming a sealing cavity with a sample and the suction cup after the sample is placed on the suction cup; the suction cup is provided with at least one vacuum hole, and the at least one vacuum hole is used for enabling the sample to be automatically leveled and adsorbed on the suction cup through vacuumizing after the sealing cavity is formed. According to the application, the special flexible sealing device is utilized, and aiming at a convex or concave large-warping-degree sample, the flexible sealing device can be easily attached to the large-warping-degree sample due to the fact that the material of the flexible sealing device is soft and wear-resistant, so that the flexible sealing device can form a sealing cavity with the sample and the suction cup; further, the sample can be automatically leveled and adsorbed on the sucking disc through vacuumizing.

Description

technical field [0001] The present application relates to the field of semiconductor technology, and in particular, to an adsorption system for samples with large warpage and an adsorption method based on the adsorption system. Background technique [0002] During semiconductor manufacturing, some samples undergo partial or total warpage deformation after multiple processing steps, which may make sample fixation, movement, and measurement impossible. For example, in the back-end production process of large-scale integrated circuits, the warpage of some 12-inch wafers has exceeded 2 mm, and because only a very small area of ​​the wafer will be in contact with the chuck (suction cup) in its natural state, it will lead to Wafer fixation, movement and measurement are not possible. [0003] Taking wafer samples as an example, there are three main ways to traditionally chuck a wafer as follows: [0004] 1) Vacuum adsorption type, this method cannot adsorb and fix highly warped w...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6838
Inventor 王磊李宾朱军
Owner RAINTREE SCI INSTR SHANGHAI