Metallic bond, metallic bond diamond grinding wheel and manufacturing method of metallic bond diamond grinding wheel
A metal bond and diamond grinding wheel technology, applied in the field of diamond grinding wheels, can solve the problems of low tin powder hardness, poor product stability, and easy precipitation, etc., to improve stability, strength and hardness, and improve the strength and uniformity of grinding wheels Effect
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Embodiment 1
[0019] The metal binder in this embodiment is composed of the following components by mass percentage: copper powder 35%, tin powder 10%, babbitt alloy 5%, hydroxy iron powder 30%, copper fiber 15%, graphite particle 5%;
[0020] The preparation method of the metal bonding agent of the present embodiment is as follows: 320 mesh copper powder, 320 mesh tin powder, 320 mesh babbitt, 0.8um hydroxy iron powder, 0.1mm diameter and 1mm length copper fiber, 140 mesh graphite particles according to The above percentages are put into a vacuum ball mill for ball milling for 4h, and then sieved to obtain a metal bond;
Embodiment 2
[0022] The metal bond diamond grinding wheel of this embodiment includes metal bond and diamond. The percentage content of metal bond in the metal bond diamond grinding wheel is 87.2%, and the mass percentage content of diamond is 12.8%. The metal bonding agent is the metal bonding agent in Example 1, and the diamond is titanium-coated diamond.
[0023] The preparation method of the metal bond diamond grinding wheel of the present embodiment comprises the following steps:
[0024] Take the 120 mesh titanium-plated diamond of the formula amount and wet it with liquid paraffin, then add the metal bond of the formula amount, and mix it with a high-energy mixer for 4 hours to obtain a molding material;
[0025] The obtained molding material was sintered by vacuum hot pressing, the sintering temperature was 840°C, the pressure was 24MPa, and the holding time was 1.2h.
Embodiment 3
[0027] A metal bond in this embodiment is composed of the following components by mass percentage: 60% copper powder, 2% tin powder, 20% babbitt, 10% hydroxyl iron powder, 7% copper fiber, and 1 graphite particle %;
[0028] The preparation method of the metal bond in this embodiment is as follows: 300-mesh copper powder, 300-mesh tin powder, 300-mesh babbitt, 1um hydroxy iron powder, 0.15mm diameter and 2mm long copper fiber, and 120-mesh graphite particles as described above The percentage is put into a vacuum ball mill for ball milling for 3.5 hours, and then sieved to obtain a metal bond;
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