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Memory module, mainboard and server device

A memory module and memory technology, which is applied in the field of memory modules, motherboards and server equipment, can solve the problems of storage capacity and memory capacity increase

Pending Publication Date: 2022-07-01
SAMSUNG ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As the volume of data handled by server equipment increases, storage capacity and memory capacity may also increase

Method used

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  • Memory module, mainboard and server device
  • Memory module, mainboard and server device
  • Memory module, mainboard and server device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] figure 1 is a view schematically showing a server device according to an example embodiment.

[0020] In an example embodiment, refer to figure 1 , the server devices 1100 to 1100n and 1200 to 1200m may configure, for example, a data center 1000 that can be used to collect and store data and provide services. However, this is just an example, and the server devices 1100 to 1100n and 1200 to 1200m may be applied to various fields other than the data center 1000 .

[0021] The data center 1000 may be a device that collects various types of data and provides services, and may be referred to as a data storage center. Data center 1000 may be a system for operating search engines and databases, and may also be a computing system used by a company or government agency. The data center 1000 may include server devices 1100 to 1100n implemented as application servers 1100 to 1100n, and may include server devices 1200 to 1200m implemented as storage servers 1200 to 1200m. The ...

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PUM

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Abstract

The present disclosure relates to a memory module, a mainboard, and a server device, in which the memory module includes a memory substrate including a main connector and an auxiliary connector configured to be connected to an external device; and a plurality of memory chips mounted on at least one of the first surface or the second surface of the memory substrate, in which the main connector is arranged on one side of the memory substrate, and the auxiliary connector is arranged on the second surface of the memory substrate.

Description

technical field [0001] Embodiments relate to memory modules, motherboards, and server devices. Background technique [0002] A server device may include storage, memory, at least one processor for its control, and the like. As the amount of data processed by the server equipment increases, the storage capacity and memory capacity may also increase. SUMMARY OF THE INVENTION [0003] Embodiments relate to a memory module comprising: a memory substrate including a main connector and an auxiliary connector configured to connect to an external device; and a plurality of memory chips mounted in a first surface or a second surface of the memory substrate At least one, wherein the primary connector is arranged on one side of the memory substrate and the auxiliary connector is arranged on the second surface of the memory substrate. [0004] Embodiments relate to a motherboard comprising: a board base; a processor socket mounted on the board base and connected to a processor; and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F13/40
CPCG06F13/4068G06F13/1673G06F13/409G11C5/04G11C5/063G06F3/0658H05K1/144H01R12/737G11C5/06G11C7/1063
Inventor 赵正显权容硕金京守金钟勋石宗铉李宗键
Owner SAMSUNG ELECTRONICS CO LTD