Semiconductor process equipment and cleaning method of electrostatic chuck
A technology of process equipment and electrostatic chuck, applied in the direction of cleaning method using gas flow, cleaning method and utensils, semiconductor/solid-state device manufacturing, etc., can solve the problems of short service life and long time consumption of electrostatic chuck, and avoid frequent Heating and cooling, solving the effect of taking a long time and shortening the time
Pending Publication Date: 2022-07-01
BEIJING NAURA MICROELECTRONICS EQUIP CO LTD
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[0005] The purpose of the embodiments of the present application is to provide a cleaning method for semiconductor process equipment and electrostatic chucks, which can solve the problems of long time-consuming cleaning of particles existing in the electrostatic chuck and short service life of the electrostatic chuck
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[0032] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present application.
[0033] The terms "first", "second" and the like in the description and claims of the present application are used to distinguish similar objects, and are not used to describe a specific order or sequence. It is to be understood that the data so used are interchangeable under appropriate circumstances so that the embodiments of the present application can be practiced in sequences other than those illustrated or described herein, and distinguish ...
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The invention discloses semiconductor process equipment and a cleaning method of an electrostatic chuck, and belongs to the technical field of semiconductor equipment. The semiconductor process equipment comprises a process chamber; the electrostatic chuck is arranged in the process chamber, and the electrostatic chuck is provided with a bearing surface; the blowing part is movably arranged in the process chamber, the blowing part can move between a first position and a second position, and under the condition that the blowing part is located at the first position, the blowing part avoids the bearing surface; and under the condition that the purging piece is located at the second position, the purging piece faces the bearing surface. According to the scheme, the problems that consumed time is long when particles existing in the electrostatic chuck are swept and the service life of the electrostatic chuck is short can be solved.
Description
technical field [0001] The application belongs to the technical field of semiconductor equipment, and in particular relates to a semiconductor process equipment and a cleaning method for an electrostatic chuck. Background technique [0002] With the rapid shrinking of the size of the integrated circuit process and the diversification of functions, the requirements for the stability of the manufacturing process of the integrated circuit are becoming more and more strict. Electrostatic chucks are widely used in semiconductor process equipment due to their excellent temperature uniformity and thermal conductivity. [0003] The electrostatic chuck is more sensitive to the particles that peel off the sidewall of the process chamber of the semiconductor process equipment (such as particles brought by aluminum or the wafer itself). It will cause insufficient adsorption force between the wafer and the surface of the electrostatic chuck, so that the wafer will be offset on the surfa...
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IPC IPC(8): H01L21/683B08B5/02
CPCH01L21/6831H01L21/6833B08B5/02
Inventor 韩为鹏邓斌
Owner BEIJING NAURA MICROELECTRONICS EQUIP CO LTD