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Laser cutting method, device and equipment and storage medium

A laser cutting, laser cutting head technology, applied in laser welding equipment, welding equipment, metal processing equipment and other directions, can solve the problems of workpiece lifting, poor processing safety, workpiece cutting and falling, etc., to avoid the effect of falling

Pending Publication Date: 2022-07-08
HANS LASER TECH IND GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Laser cutting equipment is often used in the industrial machinery industry. When the laser cutting equipment processes the workpiece, the cut part of the workpiece will fall off, the workpiece will be lifted, etc., resulting in poor processing safety and easy damage to the workpiece.

Method used

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  • Laser cutting method, device and equipment and storage medium
  • Laser cutting method, device and equipment and storage medium
  • Laser cutting method, device and equipment and storage medium

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Embodiment Construction

[0036] In order to make the objectives, technical solutions and effects of the present application clearer and clearer, the present application will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present application, but not to limit the present application. Without further description, elements, structures and features in one embodiment can also be beneficially combined with other embodiments. in the way.

[0037] Laser cutting equipment is often used in the industrial machinery industry. When the laser cutting equipment processes the workpiece, in order to ensure that the cutting workpiece does not fall, the micro-connection process is used. The function of the micro-connection process is to keep the workpiece connected to the plate after processing, to prevent the workpiece from lifting and falling, to improve processing safety ...

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PUM

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Abstract

The invention provides a laser cutting method, device and equipment and a storage medium. The laser cutting method comprises the steps that a laser cutting head is controlled to cut a workpiece along a preset cutting path; when the laser cutting head moves to the mark point, the connection type of the micro-connection area is confirmed; and if the connection type of the micro-connection area is the first connection type, the cutting speed of the laser cutting head is not changed, and other cutting parameters of the laser cutting head are adjusted to be preset values. In the laser cutting process, the upper portion of the micro-connection area can be cut off by the laser cutting head at the mark point by changing the cutting effect of the laser cutting head in real time, the micro-connection area has certain connection strength, and then connection of the two sides of the workpiece can be kept through the micro-connection area; and the situations that the cut part of the workpiece falls off and the workpiece tilts up are avoided.

Description

technical field [0001] The present invention relates to the technical field of laser processing, in particular to a laser cutting method, device, equipment and storage medium. Background technique [0002] Laser cutting equipment is often used in the industrial machinery industry. When the laser cutting equipment processes the workpiece, the cutting part of the workpiece will fall off, the workpiece will be lifted, etc., resulting in poor processing safety and easy damage to the workpiece. SUMMARY OF THE INVENTION [0003] In view of the above-mentioned deficiencies of the prior art, the present application provides a laser cutting method, device, equipment and storage medium, which can form a micro-connection area on the workpiece, and avoid the occurrence of the workpiece falling and the workpiece lifting. [0004] This embodiment adopts the following technical solutions: [0005] A laser cutting method, comprising the steps of: [0006] Control the laser cutting head ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/08B23K26/38B23K26/70
CPCB23K26/38B23K26/702B23K26/0884
Inventor 张明治张亚旭封雨鑫陈焱高云峰
Owner HANS LASER TECH IND GRP CO LTD
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