Plastic package integrated circuit batch ultrasonic scanning inspection device and method

Abstract

The invention relates to a plastic package integrated circuit batch ultrasonic scanning inspection device and method.The plastic package integrated circuit batch ultrasonic scanning inspection device comprises a first tray and a second tray, and the first tray and the second tray are each of a flat-plate-shaped structure; a plurality of first through grooves penetrating through the two opposite sides of the first tray are formed in the first tray, and first air inlet half pipes are arranged at notches in one ends of the first through grooves; a plurality of second through grooves penetrating through the two opposite sides of the second tray are formed in the second tray, and second air inlet half pipes are arranged at notches in one ends of the second through grooves; the second tray can be buckled on the first tray, the first through groove and the second through groove are encircled to form an accommodating cavity for accommodating a plastic package integrated circuit, and the first air inlet half pipe and the second air inlet half pipe are encircled to form an air inlet pipe. According to the invention, the problems that the efficiency of placing and turning over the plastic package integrated circuit in water in an ultrasonic scanning detection item is low and attached bubbles are difficult to remove can be solved, and the working efficiency and the accuracy of the detection work can be effectively improved.

Description

technical field [0001] The invention relates to the technical field of ultrasonic scanning and detection, in particular to a batch ultrasonic scanning inspection device and method for plastic-packaged integrated circuits. Background technique [0002] Ultrasonic scanning microscope inspection of plastic-encapsulated integrated circuits can effectively detect defects such as delamination, voids, and cracks in plastic-encapsulated integrated circuits. At present, when testing plastic-encapsulated integrated circuits in batches, the testing laboratories in the industry generally disassemble the plastic-encapsulated integrated circuits from tapes or trays and place them on the platform in the sink of the ultrasonic scanning microscope equipment. The process of placing the plastic-encapsulated integrated circuits in the water on the platform in the water tank is easy to drift and generate tiny bubbles attached to the surface of the plastic-encapsulated integrated circuits. The at...

AI Technical Summary

Problems solved by technology

The process of placing the plastic-encapsulated integrated circuit in the water on the platform in the water tank tends to drift and produce tiny bubbles that adhere to the surface of the plastic-enclosed integrated circuit. The attached micro-bubbles will affect the scanning imaging and scanning results. It is necessary to move the plastic-enclosed integrated circuit and remove the attached bubbles, resulting in The process of neatly arranging plastic-encapsulated integrated circuits is extremely difficult and inefficient

In the industry, small trays are used to arrange the plastic-encapsulated integrated circuits outside the sink, and the plastic-encapsulated integrated circuits are easy to move and cause air bubbles during the process of putting them into the sink, or use adhesive materials similar to double-sided tape on the small trays Fix the plastic-encapsulated integrated circuit, the fixed integrated circuit will not drift when it enters the water, but it will cause the adhesive to remain on the surface of the plastic-encapsulated integrated circuit

The above-mentioned various methods of placing plastic-encapsulated integrated circuits in water are time-consuming and laborious and cannot solve the problem of attached air bubbles. At the same time, plastic-enclosed integrated circuits need to scan and detect two views of the front and back, and the process of turning plastic-enclosed integrated circuits in water is time-consuming. And it is not easy to operate. The above-mentioned problems of placement and air bubbles lead to low efficiency of ultrasonic scanning of plastic-encapsulated integrated circuits

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