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Chip on film and display device

A chip-on-film and display panel technology, which is applied to semiconductor/solid-state device parts, semiconductor devices, electrical components, etc., can solve problems such as poor display quality of displays, and achieve the effect of improving display quality.

Pending Publication Date: 2022-07-15
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the display suffers from poor display quality

Method used

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  • Chip on film and display device
  • Chip on film and display device

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Embodiment Construction

[0030] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. Where the following description refers to the drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments are not intended to represent all implementations consistent with this disclosure. Rather, they are merely examples of means consistent with some aspects of the present disclosure, as recited in the appended claims.

[0031] The terminology used in the present disclosure is for the purpose of describing particular embodiments only and is not intended to limit the present disclosure. Unless otherwise defined, technical or scientific terms used in this disclosure should have the ordinary meaning as understood by one of ordinary skill in the art to which this disclosure belongs. As used in this disclosure and in the claims, ...

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PUM

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Abstract

The invention provides a chip on film and a display device. The chip on film comprises a substrate; the chip is arranged on the substrate; the plurality of leads are arranged on the substrate and are distributed at intervals, one end of each lead is connected to the chip, and the other end of each lead is used for being connected with a plurality of data signal lines of a display panel in a one-to-one correspondence manner; wherein at least two leads in the plurality of leads are different in length, and the length of the data signal line connected with the lead with the larger length is smaller than that of the data signal line connected with the lead with the smaller length. The display image quality can be improved.

Description

technical field [0001] The present disclosure relates to the field of display technology, and in particular, to a chip on film and a display device. Background technique [0002] Flat-panel displays have become the mainstream products on the market, and there are more and more types of flat-panel displays, such as liquid crystal displays (Liquid Crysta1 Disp1ay, LCD), organic light-emitting diode (Organic Light Emitted Diode, OLED) displays, plasma display panels (P1asma) Disp1ayPane1, PDP) and Field Emission Display (Field Emission Display, FED) and so on. The flat-panel displays in the prior art are developing in the direction of high resolution and high refresh rate. However, this monitor has a problem of poor display quality. SUMMARY OF THE INVENTION [0003] The purpose of the present disclosure is to provide a chip on film and a display device, which can improve the display quality. [0004] According to one aspect of the present disclosure, there is provided a ch...

Claims

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Application Information

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IPC IPC(8): H01L23/498
CPCH01L23/49838
Inventor 冯博杨炜帆刘磊魏重光尹晓峰
Owner BOE TECH GRP CO LTD