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High-speed jumper for enabling long-distance connection of superconducting quantum computer chips

A long-distance, chip technology, applied in 01] this invention, in the field of quantum computer chips, can solve the problem of increasing operation overhead for qubit state exchange

Pending Publication Date: 2022-07-22
IBM CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, qubit state swapping adds operational overhead, which requires the quantum system to remain coherent over a longer period of time

Method used

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  • High-speed jumper for enabling long-distance connection of superconducting quantum computer chips
  • High-speed jumper for enabling long-distance connection of superconducting quantum computer chips
  • High-speed jumper for enabling long-distance connection of superconducting quantum computer chips

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Embodiment Construction

[0022] figure 1 is a schematic diagram of a quantum processor 100 according to an embodiment of the present invention. Quantum processor 100 includes qubit chip 102 . The qubit chip 102 includes a substrate 104 and a plurality of qubits 106 formed on a first surface 108 of the substrate 104 . The plurality of qubits 106 are arranged in a pattern, wherein nearest neighbor qubits in the pattern are connected. For example, nearest neighbor qubits 110 , 112 are connected, as indicated by line 114 connecting these nearest neighbor qubits 110 , 112 . The quantum processor 100 includes a long-range connector 115 configured to connect a first qubit 112 of the plurality of qubits 106 to a second qubit 116 of the plurality of qubits 106 . The first and second qubits 112, 116 are separated by at least a third qubit 118 in the pattern.

[0023] Long-distance connectors 115 reduce the number of exchanges required to perform a two-qubit gate on non-nearest neighbor qubits. figure 2 i...

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Abstract

According to an embodiment of the invention, a quantum processor includes a qubit chip. The qubit chip includes a substrate, and a plurality of qubits formed on a first surface of the substrate. The plurality of qubits are arranged in a pattern, wherein closest adjacent qubits in the pattern are connected. The quantum processor also includes a long distance connector configured to connect a first qubit of the plurality of qubits to a second qubit of the plurality of qubits, where the first and second qubits are separated by at least a third qubit in the pattern.

Description

Background technique [0001] The presently claimed embodiments of the present invention relate to quantum computer chips and, more particularly, to a highway jumper that enables long distance connections for superconducting quantum computer chips. [0002] Superconducting quantum chips have limitations on the connectivity of qubits. Currently, the superconducting quantum chip connection scheme is "nearest neighbor". Each qubit in the quantum chip can be connected to multiple nearest neighbor qubits. However, the nearest neighbor qubits may be only a small subset of the qubits contained on this superconducting quantum chip. Thus, a given qubit may be connected to most of the qubits on the quantum chip only through one or more additional qubits. If two-qubit operation is desired in this case, multiple swap gates may be required to enable the operation. However, qubit state swapping adds operational overhead, which requires the quantum system to remain coherent over longer per...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06N10/00H01L23/48H01L23/498H10N69/00
CPCG06N10/00H01L23/48H01L23/49838H01L23/5386H01L23/49816H01L23/645G06N10/40H10N69/00
Inventor 邵东兵M·布林克M·桑博格V·阿迪格
Owner IBM CORP