Semiconductor element and preparation method thereof
A technology for semiconductors and components, applied in the field of semiconductor components and their preparation, can solve the problems of increasing number and complexity, and achieve the effect of improving performance and thermal conductivity.
Pending Publication Date: 2022-07-26
NAN YA TECH
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, during the process of shrinking dimensions, different problems are added, and such problems continue to increase in number and complexity
Therefore, there are still ongoing challenges in achieving improved quality, yield, performance and reliability, and reduced complexity
Method used
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[0113] Specific examples of components and configurations are described below to simplify embodiments of the present disclosure. Of course, these examples are for illustration only, and are not intended to limit the scope of the present disclosure. For example, in the description where the first part is formed on the second part, it may include embodiments where the first and second parts are in direct contact, and may also include additional parts formed between the first and second parts, Embodiments so that the first and second parts are not in direct contact. Additionally, embodiments of the present disclosure may repeat reference numerals and / or letters in numerous instances. These repetitions are for the purpose of simplicity and clarity and do not in themselves represent a specific relationship between the various embodiments and / or the configurations discussed, unless the context specifically indicates otherwise.
[0114] Furthermore, for ease of description, spaces ...
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Abstract
The invention provides a semiconductor element with a heat dissipation unit and a preparation method of the semiconductor element. The semiconductor element is provided with a crystal grain stack; an intermediary bonding layer disposed on the die stack; and a carrier structure. The carrier structure includes a carrier substrate disposed on the interposer bonding layer and a plurality of semiconductor through vias disposed in the carrier substrate and on the interposer bonding layer for thermal conduction.
Description
technical field [0001] This application claims priority to and benefits from US Official Application Serial No. 17 / 158,337, filed January 26, 2021, the contents of which are incorporated herein by reference in their entirety. [0002] The present disclosure relates to a semiconductor element and a manufacturing method of the semiconductor element. In particular, it relates to a semiconductor element with a heat dissipation unit, and a method for manufacturing the semiconductor element with the heat dissipation unit. Background technique [0003] Semiconductor components are used in different electronic applications such as personal computers, cell phones, digital cameras, or other electronic devices. The size of semiconductor devices is gradually decreasing to meet the increasing demands of computing power. However, during downsizing processes, different problems are added, and such problems continue to increase in number and complexity. Accordingly, challenges continue t...
Claims
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IPC IPC(8): H01L23/48H01L23/367H01L21/768H01L21/48
CPCH01L21/76898H01L21/76895H01L23/481H01L23/3677H01L21/4882H01L25/0657H01L25/18H01L25/50H01L2225/06524H01L2225/06541H01L2225/06589H01L23/3738H01L23/3737H01L24/83H01L2224/13025H01L2225/06517H01L2225/06565H01L2224/08145H01L24/80H01L2224/83896H01L2224/83193H01L2224/27452H01L2224/83862H01L2224/83203H01L2224/80379H01L2224/08225H01L2224/08146H01L2224/13023H01L24/32H01L24/08H01L2224/11462H01L2224/11334H01L2224/05663H01L2224/80457H01L2224/83481H01L2224/05655H01L2224/83591H01L2224/80481H01L2224/80466H01L2224/83476H01L2224/83466H01L2224/8047H01L2224/83484H01L2224/05657H01L2224/05624H01L2224/80476H01L2224/29186H01L2224/05647H01L2224/83486H01L2224/80424H01L2224/80484H01L2224/05683H01L2224/05681H01L2224/13111H01L2224/80447H01L2224/83447H01L2224/83693H01L2224/05686H01L2224/13139H01L2224/05676H01L2224/83457H01L2224/05666H01L2224/05684H01L2224/83424H01L2224/8347H01L2224/0567H01L2224/2919H01L2224/13147H01L2224/05567H01L2224/0557H01L2224/80357H01L2224/08121H01L2224/09181H01L2924/00014H01L2924/045H01L2924/0665H01L2924/013H01L2924/00013H01L2924/0469H01L2924/0452H01L2924/01012H01L2924/0455H01L2924/01073H01L2924/04953H01L2924/05042H01L2924/014H01L2924/04941H01L2924/0544H01L2924/01014H01L2924/01006H01L2924/04541H01L2924/01327H01L2924/01005H01L2924/01103H01L2924/07025H01L2924/044H01L2924/01028H01L2924/0492H01L2924/059H01L2924/05442H01L2924/062H01L23/49827H01L21/486
Inventor 施信益
Owner NAN YA TECH