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Wafer bonding equipment and method

A wafer bonding and wafer technology, applied in the manufacturing of electrical components, circuits, semiconductor/solid-state devices, etc., can solve the problems of large interference of optical signals, bonding failure, etc., to improve anti-interference and improve accuracy , the effect of improving clarity

Pending Publication Date: 2022-07-26
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In related technologies, the optical signal used in the alignment process is highly disturbing and prone to certain position errors, resulting in bonding failure

Method used

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  • Wafer bonding equipment and method
  • Wafer bonding equipment and method
  • Wafer bonding equipment and method

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Embodiment Construction

[0083] Exemplary embodiments disclosed in the present application will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited by the specific embodiments set forth herein. Rather, these embodiments are provided so that the present application will be more thoroughly understood, and will fully convey the scope of the present disclosure to those skilled in the art.

[0084] Exemplary embodiments disclosed in the present application will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present application are shown in the drawings, it should be understood that the present application may be embodied in various forms and should not be limited by the specific embodiments set forth herein. Rather, ...

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Abstract

The embodiment of the invention provides wafer bonding equipment and method, and the method comprises the steps: determining a first position parameter of a first alignment mark on a first wafer through a transmitted light beam; determining a second position parameter of a second alignment mark on a second wafer by using the transmitted light beam; wherein the transmission light beam penetrates through the first wafer and / or the second wafer; according to the first position parameter and the second position parameter, the relative position of the first wafer and the second wafer is adjusted by utilizing the transmission light beam, so that the relative position of the first alignment mark and the second alignment mark meets a preset bonding condition; and bonding the first wafer and the second wafer.

Description

technical field [0001] The present application relates to the field of semiconductor manufacturing, and relates to, but is not limited to, a wafer bonding apparatus and method. Background technique [0002] In recent years, the development of flash memory (Flash Memory) memory is particularly rapid. The main feature of flash memory is that it can keep stored information for a long time without powering on, and has the advantages of high integration, fast storage speed, and easy erasing and rewriting. In order to further improve the bit density (Bit Density) of flash memory and reduce bit cost (BitCost), three-dimensional flash memory (3DNAND Flash) technology has been rapidly developed. [0003] At present, in the chip manufacturing industry, especially in the field of 3D NAND Flash manufacturing, wafer bonding technology is being widely used as a new technology in the industry. Wafer bonding technology is a process of directly bonding the two wafers together after alignin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/67H01L21/60H01L21/68
CPCH01L21/67121H01L21/60H10B69/00H01L24/75H01L23/544H01L2224/80894H01L24/80H01L2224/8013H01L2223/54426H01L24/74H01L2224/80123H01L2224/80129H01L2224/80895H01L2924/1438
Inventor 陈国良刘孟勇刘洋刘武
Owner YANGTZE MEMORY TECH CO LTD