Through hole etching method for large-size ultra-thin glass substrate

Abstract

The invention provides a through hole etching method for a large-size ultra-thin glass substrate, which comprises the following steps: providing a to-be-processed glass substrate with a preset size and a preset thickness, the to-be-processed glass substrate comprising a middle area and an edge area surrounding the middle area; processing the glass substrate to be processed, and forming a groove in the middle area; forming a plurality of through holes in the groove; and cutting off the edge area to form a target glass substrate with the through hole. According to the through hole etching method, before the through hole is formed, the to-be-processed glass substrate is pretreated, the thickness of the edge area is ensured to be unchanged, and only the thickness of the middle area is reduced, so that blue insertion can be directly carried out in the etching process of the through hole, and the risks of fragment due to product bending, fragment taking and putting and the like are avoided; and thus, the production yield of the large-size ultrathin glass substrate with the through holes is improved.

Description

Technical field [0001] The present invention relates to the field of semiconductor process technology, and more specifically, to a through-hole etching method for large-size ultra-thin glass substrates. Background technique [0002] Mini LED refers to an LED flip-chip chip with a side length of approximately 50um-200um and a substrate (it should be noted that the size of some backlight chips will exceed 200um). Thousands to tens of thousands of Mini LEDs can be transferred through chip transfer technology. The wafer is transferred to a substrate such as FPCB, PCB or glass to form a high-density array arrangement, which is then packaged and used in the display field. [0003] Compared with PCB substrates, glass substrates have the advantages of smooth inner surfaces of through-hole apertures and more controllable aperture sizes. As terminal display manufacturers such as Apple release a series of Mini LED-related products, the Mini LED market is becoming increasingly popular. ...

AI Technical Summary

Problems solved by technology

[0004] At present, with the conventional process, it is impossible to make a Mini LED ultra-thin glass substrate with a through hole with a size of more than 500mm*500mm and a thickness of less than 0.1mm; the main problem is that the thickness of the glass substrate is too thin, and the etching process of the through hole , the glass substrate must be thinned on both sides, and it is impossible to rely on the backplane or the method of sticking a protective film on one side for trial production, and the risk of tooth skipping and fragmentation during the etching process is particularly high

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