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Array type ultrasonic sensor

An ultrasonic and sensor technology, applied in the field of array ultrasonic sensors, can solve the problems of wrong judgment, small sound pressure, large reflection angle, etc., and achieve the effect of improving sensitivity and sound pressure

Pending Publication Date: 2022-07-29
茂丞(郑州)超声科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, as the cavity space shrinks, the ultrasonic sensor may receive reflected ultrasonic waves before the vibration of the ultrasonic sensor stops, which may cause errors in judgment
Although it can be done by adding additional sensors, there are still problems such as too large reflection angle and too low sound pressure, which affect the sensitivity and sensing effect of ultrasonic sensors

Method used

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  • Array type ultrasonic sensor
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Embodiment Construction

[0038] It should be understood that when a component is referred to as being “connected” or “disposed” to another component, it may mean that the component is directly connected to the other component, or there may also be an intermediate component through which the component is connected to the other component. Conversely, when a component is referred to as being "directly on" or "directly connected to" another component, it will be understood that the absence of intervening components is explicitly defined at this time.

[0039] Additionally, the terms "first," "second," and "third" are only used to distinguish one element, component, region, or section from another element, component, region, layer or section, and not to denote its inevitable sequence. Furthermore, when relative terms such as "lower" and "upper" may be used herein to describe one component's relationship to another component, it should be understood that relative terms are intended to include differences in...

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PUM

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Abstract

The embodiment of the invention provides an array type ultrasonic sensor. The array type ultrasonic sensor comprises a semiconductor substrate, a first sensing array and a second sensing array, the first sensing array comprises two or more than two first ultrasonic sensing units. Each first ultrasonic sensing unit comprises a first positive electrode and a first negative electrode, the first positive electrodes of the first ultrasonic sensing units are connected in series, and the first negative electrodes of the first ultrasonic sensing units are connected in series. The second sensing array comprises two or more than two second ultrasonic sensing units. Each second ultrasonic sensing unit comprises a second positive electrode and a second negative electrode, the second positive electrodes of the second ultrasonic sensing units are connected in series, and the second negative electrodes of the second ultrasonic sensing units are connected in series. One of the first sensing array and the second sensing array is used for emitting ultrasonic waves, and the other one is used for receiving reflected ultrasonic waves.

Description

technical field [0001] The present application relates to the field of sensing, and in particular, to an array ultrasonic sensor. Background technique [0002] Ultrasonic sensors usually use the design of a hollow cavity, and can effectively distinguish the emitted ultrasonic wave and the reflected ultrasonic wave through the transmission time and phase. Therefore, it is widely used in the identification of various physiological information. [0003] With the thinning of the electronic devices used together, the thinning of the ultrasonic sensor must be achieved by reducing the hollow cavity. However, as the cavity space is reduced, the ultrasonic sensor may receive reflected ultrasonic waves before the vibration of the ultrasonic sensor has stopped, which may cause errors in judgment. Although it can be accomplished by adding additional sensors, there are still problems such as too large reflection angle and too small sound pressure, which affect the sensitivity and sensi...

Claims

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Application Information

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IPC IPC(8): G01D5/48
CPCG01D5/48
Inventor 邱奕翔李宏斌
Owner 茂丞(郑州)超声科技有限公司
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