Heat dissipation module and manufacturing method thereof

Abstract

The invention relates to a heat dissipation module and a manufacturing method thereof, the heat dissipation module comprises a heat pipe, a plurality of heat dissipation fins and a plurality of rings, and the heat pipe is provided with an outer ring wall; each radiating fin is provided with a through hole and a ring wall formed on the outer periphery of the through hole, and the radiating fins are sleeved on the heat pipe through the through holes in a spaced overlapping manner; and each ring is sleeved on each ring wall in a packing manner, so that each ring wall is embedded and tightened on the outer ring wall. Therefore, the heat dissipation module has excellent heat dissipation efficiency and structural strength.

Description

technical field [0001] The present invention relates to a heat dissipation module including a heat pipe and a plurality of heat dissipation fins, and more particularly, to a heat dissipation module and a manufacturing method thereof. Background technique [0002] As the command cycle of electronic components continues to increase, the heat generated by them is also getting higher and higher. In order to effectively solve the problem of high heat generation, various forms of heat dissipation devices have been designed in the industry to provide heat dissipation, but the existing heat dissipation devices There is still room for improvement in practical applications. [0003] The known heat dissipation device mainly includes a heat pipe, a heat conduction block and a plurality of heat dissipation fins. , so that the heat of electronic components such as the central processing unit is dissipated to the external environment through the heat pipe and the fin group. [0004] Howe...

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Problems solved by technology

[0004] However, in the above-mentioned process where the heat dissipation fins are arranged in series on the heat pipe, if the heat dissipation fins cannot be firmly positioned on the heat pipe, the heat dissipation efficiency and structural strength of the heat dissipation device will be affected.

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