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Radio frequency device and method for manufacturing radio frequency device

A radio frequency device and radio frequency radiation technology, applied in the field of radio frequency technology, can solve the problems of expensive radio frequency laminates, transportation loss, etc.

Pending Publication Date: 2022-08-02
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

To do this, boards usually have to have expensive RF laminates for the RF signal path
Also, with this method, transit losses may occur in the signal transmission between the RF chip and the RF antenna

Method used

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  • Radio frequency device and method for manufacturing radio frequency device
  • Radio frequency device and method for manufacturing radio frequency device
  • Radio frequency device and method for manufacturing radio frequency device

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0100] Example 1 is a radio frequency device, comprising: a circuit board; a radio frequency package mounted on the circuit board, having a radio frequency chip and a radio frequency radiation element;

[0101] a waveguide assembly having a waveguide, wherein the radio frequency radiating element is designed to radiate a transmit signal into the waveguide and / or receive a receive signal through the waveguide; a gap arranged between a first side of the radio frequency package and a second side of the waveguide assembly; and a shielding structure designed to allow relative movement between the radio frequency package and the waveguide component in a first direction perpendicular to the first side of the radio frequency package, and to shield transmit and / or receive signals such that the signal Propagation through the gap is attenuated or prevented.

example 2

[0102] Example 2 is the radio frequency device of example 1, wherein the shielding structure forms a waveguide designed to transmit transmit and / or receive signals between the radio frequency radiating element and the waveguide of the waveguide component.

example 3

[0103] Example 3 is the radio frequency device of examples 1 or 2, wherein the gap has a width in the first direction in the range of 100 microns to 250 microns.

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PUM

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Abstract

The embodiment of the invention relates to a radio frequency device and a method for manufacturing the radio frequency device. A radio frequency device comprises a printed circuit board and a radio frequency package which is installed on the printed circuit board and provided with a radio frequency chip and a radio frequency radiating element. The radio frequency device further comprises a waveguide component having a waveguide, in which the radio frequency radiating element is designed to radiate a transmit signal into the waveguide and / or to receive a receive signal through the waveguide. The radio frequency device further comprises a gap arranged between the first side of the radio frequency package and the second side of the waveguide component and a shielding structure designed to allow relative movement between the radio frequency package and the waveguide component in a first direction perpendicular to the first side of the radio frequency package and shield the transmit signal and / or the receive signal, the propagation of the signal through the gap is weakened or blocked.

Description

technical field [0001] The present disclosure generally relates to radio frequency (Radio Frequency, Hochfrequenz) technology. In particular, the present disclosure relates to radio frequency devices and methods for making radio frequency devices. Background technique [0002] For example, radio frequency devices can be used in automotive safety applications. For example, radar sensors can be used for blind spot detection, automatic speed control, collision avoidance systems, and more. In one known method, the radio frequency signal provided by the radio frequency device may be transmitted by an antenna arranged on a printed circuit board. To this end, the circuit board must often have expensive RF laminates for the RF signal paths. Furthermore, using this method, transport losses may occur in the signal transmission between the RF chip and the RF antenna. Manufacturers of radio frequency devices are constantly striving to provide improved radio frequency devices and met...

Claims

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Application Information

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IPC IPC(8): H01P1/06H01P11/00G01S7/02
CPCH01P1/06H01P11/00G01S7/02H01Q1/2283H01P5/107H01Q13/06H01Q1/526H01Q23/00
Inventor W·哈特纳K·埃利安T·厄尔德埃尔C·盖斯勒B·里德R·M·沙勒H·托伊斯M·沃杰诺维斯基
Owner INFINEON TECH AG