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Double-gate transistor memory cell, data read-write method, manufacturing method and memory

A double-gate transistor and storage unit technology, applied in the storage field, can solve the problem of storage capacitor integration limiting the minimum area of ​​the storage unit, and achieve the effect of eliminating the area reduction

Pending Publication Date: 2022-08-05
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Abstract
  • Description
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  • Application Information

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Problems solved by technology

[0006] In view of the deficiencies in the prior art above, the object of the present invention is to provide a double-gate transistor storage unit, a data reading and writing method, a manufacturing method and a storage device, so as to solve the integration limitation of the storage capacitor in the integration process of the existing ferroelectric storage device The problem of the minimum area of ​​the storage unit

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  • Double-gate transistor memory cell, data read-write method, manufacturing method and memory
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  • Double-gate transistor memory cell, data read-write method, manufacturing method and memory

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Embodiment Construction

[0053] The present invention provides a dual-gate transistor memory cell, a data reading and writing method, a manufacturing method and a memory. In order to make the purpose, technical solutions and effects of the present invention clearer and clearer, the present invention is further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention.

[0054] In the embodiments and claims, "a," "an," "said," and "the" may also include plural forms unless the context specifically limits the articles. If there are descriptions involving "first", "second", etc. in the embodiments of the present invention, the descriptions of "first", "second", etc. are only for the purpose of description, and should not be construed as indicating or implying their relative Importance or implicitly indicates the number of t...

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Abstract

The invention discloses a double-gate transistor memory cell, a data read-write method, a manufacturing method and a memory, and the double-gate transistor memory cell comprises a first gate; the first dielectric layer is arranged on the top surface of the first grid electrode; the channel layer is arranged on the top surface of the first dielectric layer; the source electrode and the drain electrode are arranged on the top surface of the first dielectric layer and located on the two sides of the channel layer; wherein the first dielectric layer comprises a ferroelectric layer, and the ferroelectric layer is located on the bottom surface of the source electrode and the bottom surface of the drain electrode; the second dielectric layer is arranged on the top surface of the channel layer; and the second grid electrode is arranged on the top surface of the second dielectric layer. According to the invention, a transistor is used as a memory unit, so that the defect that a memory capacitor limits the reduction of the area of the memory unit is eliminated, and the ferroelectric memory can be well applied to a three-dimensional integration technology.

Description

technical field [0001] The present invention relates to the technical field of storage, in particular to a dual-gate transistor storage unit, a data reading and writing method, a manufacturing method and a memory. Background technique [0002] Ferroelectric material refers to a material with ferroelectric effect. It has ferroelectricity and piezoelectricity, that is, it can spontaneously polarize within a certain temperature range, and if pressure is applied to the material in a certain direction, its internal Polarization occurs, creating a charge on the surface. Ferroelectric memory is a storage structure using ferroelectric materials, which can achieve the purpose of non-volatile storage. It is widely used in low-voltage, low-power applications, and can be used as a stand-alone memory or embedded in microcontrollers and microprocessors. Its excellent characteristics make it a potential replacement for Electrically Erasable Programmable Read-Only Memory (EEPROM), Flash (...

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Application Information

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IPC IPC(8): G11C11/22
CPCG11C11/221G11C11/223G11C11/2273G11C11/2275
Inventor 李毅达周冰程振林龙扬张国飙沈美朱泉舟
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA