Automatic chip mounting equipment and automatic chip mounting method
An automatic patch and equipment technology, applied in electrical components, conveyor objects, transportation and packaging, etc., can solve problems such as the inability to apply mechanical feeding methods, achieve fully automatic removal of protective parts process, ensure production efficiency and Yield, the effect of solving the lead frame feeding problem
Pending Publication Date: 2022-08-05
SIPLP MICROELECTRONICS CHONGQING CO LTD
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Problems solved by technology
It is even more inapplicable to the above-mentioned mechanical feeding method
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[0085] Exemplary embodiments will be described in detail herein, examples of which are illustrated in the accompanying drawings. Where the following description refers to the drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the illustrative examples below are not intended to represent all implementations consistent with this application. Rather, they are merely examples of apparatus and methods consistent with some aspects of the present application as recited in the appended claims.
[0086] The terminology used in this application is for the purpose of describing particular embodiments only and is not intended to limit the application. Unless otherwise defined, technical or scientific terms used in this application shall have the ordinary meaning as understood by those of ordinary skill in the art to which this application belongs. Words like "a" or "an" used in the specific...
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The invention provides automatic surface mounting equipment and an automatic surface mounting method, and aims to solve the problem that a large number of lead frame products cannot be automatically mounted. The automatic surface mounting equipment comprises a lead frame feeding mechanism, a carrier plate feeding mechanism, a surface mounting mechanism and a controller, the lead frame feeding mechanism comprises a first carrier table used for placing a plurality of stacked lead frames, and every two adjacent lead frames stacked up and down are spaced through a protection piece; the first mechanical claw is used for taking a single lead frame or a protection piece from the first carrying table and placing the single lead frame on the second carrying table; the weight detection device is used for detecting weight data of the articles taken by the first mechanical claw; the controller is used for judging whether the object taken by the first mechanical claw is the lead frame or the protection piece according to the weight data; and under the condition that the object taken by the first mechanical claw is the lead frame, the first mechanical claw is controlled to place the lead frame on the second carrying table. The automatic chip mounting method is applied to the automatic chip mounting equipment.
Description
technical field [0001] The present application relates to an automatic patching device and an automatic patching method. Background technique [0002] Since the lead frame in the traditional package does not need to be mounted on a certain bearing surface, there is already a plane for attaching the chip in each unit of the lead frame, so it can be used directly, and only needs to be put into the chip for mounting. In the machine, the chip can be directly mounted. [0003] The main purpose of the lead frame used in the new fan-out package is for the double-sided interconnection of the chip, that is, to connect the front circuit structure of the chip and the back of the chip, and can also play the role of multi-chip interconnection, so this kind of The chip position of the lead frame is completely hollowed out, and the lead frame needs to be mounted on a flat carrier board for chip mounting. [0004] At present, in the new fan-out package, the lead frame is mostly manual wor...
Claims
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IPC IPC(8): H01L21/67H01L21/677
CPCH01L21/67144H01L21/67138H01L21/67742
Inventor 王鑫璐
Owner SIPLP MICROELECTRONICS CHONGQING CO LTD