Low-power-consumption waveform data acquisition method and terminal
A waveform data acquisition terminal technology, applied in the sensor field, can solve the problems of difficult alignment of data axes, high system power consumption, and high system power consumption.
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Embodiment 1
[0048] In mechanical fault diagnosis and predictive maintenance, geological disaster monitoring and early warning, marine disaster monitoring and early warning, civil engineering structure safety monitoring and early warning, transmission line engineering safety monitoring and early warning and other industries, sensors are needed to solve the vibration, trajectory and attitude of objects. analyse problem. At present, there are two methods for simultaneously measuring the parameters of object vibration, trajectory and attitude (static inclination) with a sensor in the prior art:
[0049] a. One is to use an acceleration sensor, which can calculate the vibration of the object and the inclination of the object (compared to the analysis of gravitational acceleration). At the same time, the acceleration data can be used to calculate the displacement of each axis through mathematical integration.
[0050] b. The other is to measure the vibration, trajectory, and attitude (static in...
Embodiment 2
[0079] This embodiment discloses a circuit structure of a fusion multi-sensing component. The circuit structure of this embodiment at least includes a first acceleration sensing component 120, an inertial measurement sensing component 140 and an inclination angle sensing component 150.
[0080] Figure 17 It is a schematic diagram of the circuit structure of the fusion multi-sensing component inside the terminal according to a preferred embodiment of the present invention.
[0081] Figure 17 The illustrated first acceleration sensing assembly 120, inertial measurement sensing assembly 140, and tilt sensing assembly 150 are provided on the same circuit board. The sensing assembly needs to be installed away from the surrounding mechanical mounting holes to avoid external stress being transmitted to the sensing assembly. The three sensing components are arranged in an axis-aligned manner, which facilitates data alignment during data processing and achieves high-precision data...
Embodiment 3
[0098] This embodiment is a further improvement of Embodiments 1 and 2 and their combination, and repeated content will not be repeated.
[0099] Preferably, as Figure 18 Shown is a circuit board on which only the second acceleration sensor assembly 160 is installed. The second acceleration sensing component 160 transmits the measured vibration data to the processing module 110 through the interface. Preferably, the communication protocol may be the SPI communication protocol. The second acceleration sensing component 160 is composed of at least a second acceleration sensor 161, a filter 162, a voltage follower 163 and a high-speed ADC 164. Preferably, the second acceleration sensor 161 may be a MEMS-IEPE high frequency acceleration sensor. Preferably, the MEMS-IEPE high-frequency acceleration sensor adopts ADXL100X series MEMS IEPE chips. The second acceleration sensor 161 outputs an analog signal, which is sampled by the filter 162, the voltage follower 163, and the hig...
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