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Shaping structure and method for packaging outer lead

A technology for encapsulating outer leads and outer leads, applied in the direction of climate sustainability, final product manufacturing, sustainable manufacturing/processing, etc., can solve the problems of small lead pitch, low shaping efficiency, large quantity, etc., to improve accuracy and efficiency, the effect of reducing damage

Pending Publication Date: 2022-08-09
南京睿芯峰电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] (1) Manual shaping, it is difficult to guarantee the accuracy of reset
In the process of shaping, the shape, spacing, flatness, etc. of the leads can only be judged with the naked eye, and it is difficult to ensure consistency; and manual shaping, in the process of breaking and moving the leads, it is difficult to determine whether the leads are damaged or not ensure
[0005] (2) Low shaping efficiency
For high-density lead-type packages, the lead pitch is small and the quantity is large. Manual shaping can only adjust one lead at a time, resulting in long processing cycle and high labor cost.

Method used

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  • Shaping structure and method for packaging outer lead
  • Shaping structure and method for packaging outer lead
  • Shaping structure and method for packaging outer lead

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Embodiment Construction

[0028] The present invention will be further described below with reference to the accompanying drawings and specific embodiments, so that those skilled in the art can better understand the present invention and implement it, but the embodiments are not intended to limit the present invention.

[0029] A method for shaping outer leads of a package, comprising the following steps:

[0030] A shaping rod is arranged in the gap between adjacent outer leads, and the shaping rod vibrates and reciprocates along the gap to shape the outer leads horizontally;

[0031] Two shaping plates are arranged on the upper and lower sides of the outer leads, and the two shaping plates are close to each other so that all the outer leads are continuously pressed together. The two shaping plates are continuously pressing the outer leads and the shaping plates vibrate to shape the outer leads in the vertical direction. .

[0032] In the invention, the shaping rod reciprocates along the gap to resha...

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Abstract

The invention relates to the technical field of electronic component processing, and relates to a shaping structure and method for packaging an outer lead. The shaping rod reciprocates along the gap to shape the outer lead in the horizontal direction, the two shaping plates continuously press the outer lead to shape the outer lead in the vertical direction, lead shaping of the packaged outer lead in the horizontal direction and the vertical direction is completed at a time, and the lead shaping accuracy and efficiency are improved; meanwhile, the vibration of the shaping rod and the shaping plate in the shaping process of the outer lead can reduce the damage to the outer lead.

Description

technical field [0001] The invention relates to the technical field of electronic component processing, and relates to a shaping structure and method for packaging outer leads. Background technique [0002] For packaged products with outer leads, such as QFP, SOP, FP, etc., during the process of product assembly, packaging and transportation, screening and assessment, and whole machine installation, the outer leads are often deformed, which affects the use of electronic products. The deformation of the outer lead may be the deformation in the horizontal direction or the deformation in the vertical direction. [0003] At present, the deformation of the outer lead of the package is mostly restored by manual shaping, such as using tweezers to adjust and reset each pin. With the manual shaping method, there are the following problems: [0004] (1) Manual shaping, it is difficult to ensure the accuracy of the reset. In the process of shaping, only the naked eye can be used to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B21F1/02
CPCB21F1/02B21F1/004Y02P70/50
Inventor 李宗亚敖国军
Owner 南京睿芯峰电子科技有限公司
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