Novel compounding method based on high-barrier rigid material on solvent-free compounding machine

Abstract

The invention discloses a novel compounding method on a solvent-free compounding machine based on a high-barrier rigid material, which comprises the following steps: firstly, enhancing the hardness and pressure of a rubber roller to improve the compounding stickiness of two film materials in the compounding process, and optimizing the problem that the two film materials are poor in air permeability during PA / PET compounding; the problem that air or gas clamped between two membrane materials is difficult to discharge is solved, the product defect that white spots or bubbles appear after curing is effectively avoided or greatly reduced to a certain extent, the winding appearance state can be detected in the compounding process, and in addition, by adjusting the compounding speed or adopting a step-by-step upward adjustment method, the production efficiency can be improved. According to the double-sided tape winding device, the two films are combined to achieve stable batch production, meanwhile, the stretching and extending adaptability of the two films can be guaranteed by combining dynamic winding tension and winding taper adjustment, finally, the paving effect of the composite roll material is guaranteed to the maximum extent through the double processes of double-sided tape pasting during discharging and hanging and curing during placement, and the problem that final forming of products is affected is effectively avoided.

Description

technical field [0001] The invention relates to the technical field of packaging material production, in particular to a novel compounding method based on a high-barrier rigid material on a solvent-free compounding machine. Background technique [0002] At present, the usual structures of seed packaging manufacturers are OPP / VMPET / PE and PET / PA / PE. With the increasing demand in the northern market, the material structure of PET / PA / PE occupies most of the products. Because the temperature in the north is lower, the material structure cannot be changed. [0003] In the past, this kind of structure was compounded on a dry compound machine. In the later period, attention was paid to environmental protection and production costs were reduced, and solvent-free compounding must be considered. [0004] High-barrier rigid structures are compounded on a solvent-free laminating machine, which has the dilemma of "difficulty in process control and difficult in production". For many year...

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Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a new composite method based on high-barrier rigid materials on a solvent-free composite machine to solve the difficulty in production process control and production of high-barrier rigid materials on a solvent-free composite machine in the prior art. organizational issues

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