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Display panel and manufacturing method thereof

A technology for a display panel and a manufacturing method, which is applied in the fields of semiconductor/solid-state device manufacturing, semiconductor devices, electrical components, etc., to achieve the effect of improving product quality

Pending Publication Date: 2022-08-09
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention provides a display panel and its manufacturing method, which can alleviate the current technical problem that the film layer is formed in the unintended encapsulation film-forming area in the inorganic film used to block water / oxygen intrusion in the display panel

Method used

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  • Display panel and manufacturing method thereof
  • Display panel and manufacturing method thereof
  • Display panel and manufacturing method thereof

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Embodiment Construction

[0035] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention. In addition, it should be understood that the specific embodiments described herein are only used to illustrate and explain the present invention, but not to limit the present invention. In the present invention, unless otherwise stated, the directional words such as "upper" and "lower" generally refer to the upper and lower parts of the device in actual use or working state, specifically the direction of the drawing in the accompanying drawings. ...

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Abstract

The embodiment of the invention discloses a display panel and a manufacturing method thereof, and the display panel is provided with a display area and comprises a substrate; the light-emitting device layer is located on the substrate and comprises a plurality of light-emitting devices, and the light-emitting devices are located in the display area; the packaging layer is located on the light emitting device layer, and the packaging layer covers the light emitting device in the overlook direction of the display panel; wherein the packaging layer comprises a first inorganic packaging layer, the first inorganic packaging layer comprises a first sub-layer and a second sub-layer located on the first sub-layer, and the orthographic projection of the second sub-layer on the substrate is located in the orthographic projection of the first sub-layer on the substrate. The orthographic projection of the second sub-layer in the first inorganic packaging layer on the substrate is located in the orthographic projection of the first sub-layer on the substrate, so that the second sub-layer is prevented from being formed in an unexpected packaging film forming area, and the product quality of the display panel is improved.

Description

technical field [0001] The invention relates to the field of display, in particular to a display panel and a manufacturing method thereof. Background technique [0002] At present, the inorganic thin films used to block water / oxygen intrusion of display panels are usually prepared by plasma-enhanced chemical vapor deposition (PECVD, Plasma Enhanced Chemical Vapor Deposition) or atomic layer deposition (ALD, Atomic Layer Deposition). Due to the limitation of the film formation method, the deposition method has poor coverage of the step structure in the display panel. Therefore, the atomic layer deposition method and the plasma enhanced chemical vapor deposition method are used in combination with various deposition methods to improve the barrier water / water resistance of the inorganic film. oxygen capacity. However, since atomic layer deposition and other methods do not have regioselectivity during film formation, the inorganic encapsulation film layer will also be formed in...

Claims

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Application Information

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IPC IPC(8): H01L27/32H01L51/52H01L51/56
CPCH10K59/122H10K50/8426H10K71/00
Inventor 苗洋
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD