Method for forming end face electrode

Abstract

There is provided a method for forming end-face electrodes in which the end-face electrode can be securely formed with solder at a position in which a side electrode is formed and it can be formed without being affected by a jig for fixing a solder solid. By forming linear gaps on a master substrate, module substrates and a waste substrate are formed. At the side end of the gap of the module substrate, a side electrode is formed. A solder solid is pressed into the part of the gap in which the side electrode is formed and a reflow jig is placed. The surface of the solder solid is coated with flux and the solder solid is melted by heating so as to form the end-face electrode protruding from the substrate surface in the side electrode.

Description

technical field [0001] The present invention relates to a method of forming end-face electrodes, and more particularly, to a method of forming end-face electrodes with solder on the end faces of substrates on which electronic components such as module assemblies are mounted. Background technique [0002] Figure 18 is a plan view of a host substrate used in the conventional formation method of facet electrodes. The master substrate 1 has a plurality of linear slits 2 formed thereon. With these slits 2, a plurality of rectangular module substrates 3 are formed on the main substrate 1, and waste substrates 4 are formed around them. On the end face of the module substrate 3, a plurality of side electrodes 5 are formed in spaces between adjacent electrodes 5 against the waste substrate 4 interposed in the gap therebetween. On the module substrate 3, electrode wirings (not shown) are formed. Then, electronic components (not shown) are mounted on the module substrate 3 so that ...

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Problems solved by technology

At this time, thermal deformation of the fixing jig will occur

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