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Non-conductive substrate forming band or panel, on which are formed plurality of support elements

A technology for supporting components and substrates, which is applied in the directions of electrical components, electrical connection printed components, and printed circuits assembled with electrical components.

Inactive Publication Date: 2005-04-27
INFINEON TECH AG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But the disadvantage is that the coil terminals of the semiconductor chip are inserted from the side of the contact surface, and then this supporting element becomes one piece

Method used

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  • Non-conductive substrate forming band or panel, on which are formed plurality of support elements
  • Non-conductive substrate forming band or panel, on which are formed plurality of support elements
  • Non-conductive substrate forming band or panel, on which are formed plurality of support elements

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0015] figure 1 A sectional view is shown containing a strip 1 on which pairs of four support elements are formed. It is also possible to arrange more support elements than two adjacent support elements on the strip. The strip contains a non-conductive matrix 2, the material of which may be, for example, glass-fiber-reinforced epoxy resin.

[0016] The base body 2 contains holes 3 along both sides, which holes 3 are extended by means of clips protruding into the holes 3 , for example in the case of modules with semiconductor chips or strips for functional testing.

[0017] The outer contour of the support element is marked by a broken line 4 . The complete support element is punched out of the strip 1 along the line 4 or separated in a similar manner.

[0018] The electrically non-conductive base body 2 is processed through a metal film, preferably a copper film. The metal film is formed by subsequent etching, so that contact surfaces 5 are formed within the outer contour ...

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PUM

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Abstract

The invention relates to a non-conductive substrate (2) forming a band or panel on which are embodied a plurality of support elements, notably for incorporation into a chip card. One side of the substrate (2) has conductive contact surfaces (6) which lie within an outer contour line (4) that determines the size of one support element. The other side of the substrate (2) has conductive structures (9, 10, 11, 14, 15) which, within the outer contour line (4), form at least contact areas (11) for at least one coil to be contacted and at least one semi-conductor chip. Outside each outer contour line (4) the recesses (13) in the substrate (2), through which the connections to the coil of the semi-conductor chip can be accessed for test purposes from the side of the contact surface as long as the support element remains in the band or panel.

Description

technical field [0001] The invention relates to a non-conductive substrate constituting a strip or plate on which a plurality of support elements are formed. Background technique [0002] Support elements separated by these base bodies are known from Figures 8 and 9 of EP 0 671 705 A2. These support elements are formed in the chip card, which can work contactlessly via a plurality of contact surfaces or contactlessly via an antenna coil, eg a transducer connection. [0003] The supporting element of the smart card serves to mechanically support the smart card and additionally contains the contact surfaces necessary for making contact with the chip. It is used in contacted smart cards so that the insertion and removal of the smart card is only possible via the contact surfaces, and in so-called combination cards by means of conductors in the card and / or on the support element or in the card The strips additionally enable contactless insertion and removal. The conductor str...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06K19/07G06K19/077H05K1/02H05K1/11H05K1/18H05K3/00H05K3/30
CPCG06K19/07747G06K19/07769H05K3/0097H05K1/11H05K1/0266G06K19/07749G06K19/07743G06K19/077
Inventor P·斯塔姆普卡M·胡伯G·施劳德P·斯特里格尔H·-G·门施
Owner INFINEON TECH AG