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Two-side exposure system

A technology of exposure system and exposure position, which can be applied to microlithography exposure equipment, photolithographic process exposure devices, electrical components, etc., and can solve problems such as increased operating costs.

Inactive Publication Date: 2005-05-25
HOWA MASCH LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, the loop time is up to 32 seconds, which is Figure 14A 1.5 times the cycle time required for the operation shown, so the operating cost of the lamp 111 increases abruptly to nearly Figure 14A 1.5 times the running cost required for the indicated operation

Method used

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  • Two-side exposure system
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Examples

Experimental program
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Embodiment Construction

[0034] Refer below Figure 1~3 , the structure of a double-sided exposure system 1 of a preferred embodiment of the present invention for processing a substrate for forming a printed circuit board by an exposure method will be described.

[0035] exist figure 1 In , it is assumed that this side of the paper is the front side, the other side of the paper is the back side, the left side of the figure is the left side, and the right side of the figure is the right side. refer to Figure 1~3 A wall-like substrate 5 is vertically disposed in the middle area inside the housing 3 so as to form an optical system cavity 7 behind the substrate 5 . The horizontal partition 9 is arranged in the front space of the base plate 5 at the middle position of the height of the above-mentioned space. The space below the partition 9 is used as the receiving / transporting chamber 11 , and the space above the partition 9 is used as the exposure chamber 13 . A hole 9 a is formed in the middle port...

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PUM

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Abstract

A double-sided exposure system (1), comprising a first job holding device (21L), which is used to hold a substrate (P) opposite to an exposure mask (55), so as to pass through the exposure mask (55) to The first surface of the substrate (P) is exposed; the second operation holding device (21R) is used to hold the substrate (P) opposite to another exposure mask (55) so as to pass through the exposure mask (55) Exposure is performed on the second surface of the substrate (P). The stages of receiving, transferring and preprocessing operations for unexposed substrates and for substrates having an exposed surface can be staggered in order to prevent time lost due to waiting during exposure operations.

Description

technical field [0001] The present invention relates to double-sided exposure systems. More specifically, the present invention relates to a double-sided exposure system capable of passing through a mask with a predetermined pattern, in particular with a lamp exposure light source, for example substrates for printed circuits, thin plates for lead frames Make an exposure. Background technique [0002] Generally, an ultra-high pressure mercury lamp is used as an exposure light source in processes such as manufacturing high-density printed circuit boards in order to obtain high resolution. This type of mercury lamp is an expensive lamp, and its price is as high as 500,000 yen. The above process requires the mercury lamp to be continuously illuminated, and the service life of the mercury lamp is only about 500 hours. Exposure systems of this type must then, if possible, have a single light source which must be used with the highest possible economic efficiency; The light sou...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20H05K3/00
Inventor 冈本惇
Owner HOWA MASCH LTD