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Printed circuit board and its making method and circuit module with printed circuit board

A technology of printed circuit boards and traces, applied in the field of printed circuit boards, can solve the problems of leaving, not proposing surface fixing devices, etc.

Inactive Publication Date: 2005-09-21
KK TOSHIBA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Document No. 2000-261131 does not propose a technique to prevent the movement of the surface-mounted device from the desired position

Method used

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  • Printed circuit board and its making method and circuit module with printed circuit board
  • Printed circuit board and its making method and circuit module with printed circuit board
  • Printed circuit board and its making method and circuit module with printed circuit board

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] The first embodiment of the present invention will combine Figures 1 to 7 Give clarification.

[0030] figure 1 A portable notebook computer 1 or an electronic device is shown. The portable computer 1 includes a main body 2 and a display part 3 supported on the main body 2 .

[0031] The main body 2 has a housing 4 shaped like a flat box. The housing 4 has a bottom wall 4a and a top wall 4b. The upper surface of the top wall 4 b has a keyboard receptacle 5 . The receptacle 5 holds the keyboard 6 . The display unit 3 includes a display housing 7 housing a liquid crystal display panel (not shown). The display case 7 is connected to the rear edge of the case 4 and can be rotated.

[0032] The case 4 accommodates the circuit module 10 and the cooling fan 11 . The cooling fan 11 is provided for cooling the circuit module 10 . More specifically, the fan 11 receives air that enters the housing 4 through the air intake hole 12 on the housing 4 , and sends the air, ie ...

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PUM

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Abstract

A printed circuit board includes a substrate having a mounting surface on which a surface mount device having at least one terminal is to be mounted. On the mounting surface, at least one footprint is arranged and positioned to align with the terminal. The footprint comprises a plurality of patterned parts and a plurality of solder layers formed on the patterned parts, respectively. Each patterned part is so shaped to limit a region in which molten solder flows when the solder layer is melted.

Description

field of invention [0001] The present invention relates to a printed circuit board having soldering traces to which surface mount components can be soldered. The present invention also relates to a circuit module to which surface mount components are soldered. The present invention also relates to It relates to a method of manufacturing a printed circuit board with solder traces. Background technique [0002] Surface mount devices, such as unpackaged bare chips, small outline packages (SOPs), or quad flat packages (QFPs), are attached to the mounting area of ​​a printed circuit board by reflow soldering. Remelting welding is carried out according to the following steps. [0003] First, a printed circuit board is prepared, which has a mounting area and several soldering traces made on the mounting area. Next, solder paste is deposited on the solder traces so that a solder layer covering the solder traces is formed. Then, the surface mount device is mounted at the position ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/11H05K1/18H05K3/34
CPCH05K3/3442H05K2201/09663H05K2201/099H05K2201/0373Y10T29/49144H05K2201/09709H05K2201/10689H05K3/3421H05K3/3452H05K2203/048H05K1/111H05K2201/10636Y02P70/50
Inventor 渡部永久
Owner KK TOSHIBA