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Antioxidation leadless welding material

A lead-free solder, anti-oxidation technology, applied in the direction of welding/cutting medium/material, welding medium, welding equipment, etc., can solve the problem of unresolved anti-oxidation of lead-free solder, affect the welding quality, and the price of silver is expensive, etc., to achieve Improve the anti-oxidation performance, improve the mechanical properties, the effect of low price

Inactive Publication Date: 2006-01-25
ZHEJIANG METALLURGICAL RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the main component of lead-free solder is tin, its melting point is about 50°C higher than that of tin-lead eutectic solder, and the use temperature is also increased accordingly, so it is easy to oxidize and affect the soldering quality, so the oxidation resistance of lead-free solder is particularly special. Important, but judging from existing reports, the anti-oxidation problem of lead-free solder has not yet been resolved; and because indium and silver are expensive and resources are limited, it is difficult to fully promote the use of lead-free solder in the electronics industry.

Method used

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Embodiment Construction

[0006] According to the general inventive concept, the chemical composition and weight percentage range (Wt%) of the anti-oxidation lead-free solder of the present invention can adopt the following five preferred invention solutions.

[0007] 1. (2.0-5.0) Cu, (0.01-0.5) Ag, (0.01-0.5) Sb, (0.002-0.2) In, (0.01-0.5) Ni, (0.002-0.1) Ga, (0.002-0.1) P , (0.01-2.0) RE; the balance is Sn and the usual content of impurities.

[0008] 2. (2.0-5.0) Cu, (0.01-0.5) Ag, (0.002-0.2) In, (0.002-0.1) Ga, (0.002-0.1) P, (0.01-2.0) RE; the balance is Sn and usually content of impurities.

[0009] 3. (0.05-2.0) Cu, (2.0-5.0) Sb, (0.002-0.2) In, (0.002-0.1) Ga, (0.002-0.1) P, (0.01-2.0) RE; the balance is Sn and usually content of impurities.

[0010] 4. (0.05-2.0) Cu, (0.002-0.2) In, (0.01-0.3) Sb, (0.002-0.1) Ga, (0.002-0.1) P, (0.01-2.0) RE; the balance is Sn and usually content of impurities.

[0011] 5. (1.0-4.0) Ag, (0.05-2.0) Cu, (0.002-0.2) In, (0.002-0.1) Ga, (0.002-0.1) P, (0.01-...

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Abstract

An antioxidizing Pb-free solder for PCB is aimed at reducing cost and improving soldering performance. It has 5 formulas and one of them is Cu (2-5 wt.%), Sb (0.01-0.5), Ag (0.01-0.5), In (0.002-0.2), Ni (0.01-0.5), Ga (0.002-0.1), P (0.002-0.1), RE (0.01-2) and Sn (rest). Other four are also disclosed. Its advantages are strong antioxidizing performance and no poison and pollution.

Description

technical field [0001] The invention belongs to soldering materials and relates to lead-free solder on printed circuit boards Background technique [0002] At present, the most commonly used soldering material for electronic assembly and packaging in the electronics industry is tin-lead eutectic solder, which has the characteristics of low cost, good electrical conductivity, and excellent mechanical soldering performance. However, lead and lead compounds are toxic and harmful substances. Solder is harmful to human health in the process of production and use, and it is easy to cause cancer. Soldering waste will seriously pollute the environment. Countries all over the world are paying more and more attention to the use of lead, and the voice of banning its use is increasing day by day. In recent years, the research and development of lead-free solder has developed rapidly. Judging from the existing research results at home and abroad, tin (Sn) is the main material, and copp...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K35/26
Inventor 顾小龙杨倡进
Owner ZHEJIANG METALLURGICAL RES INST