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Measuring apparatus for thin-membrane adhesive force by stripping method

A measuring device and adhesion technology, applied in the direction of measuring devices, mechanical devices, instruments, etc., can solve problems such as inability to measure, inconvenient operation, and difficulty in measuring the magnitude of applied force, so as to facilitate popularization and use, improve accuracy, and structure simple effect

Inactive Publication Date: 2006-04-05
SHANGHAI INST OF OPTICS & FINE MECHANICS CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Obviously, this method is relatively rough, and can only qualitatively explain the size of the adhesion of the film, and cannot be measured quantitatively. Moreover, for dielectric films with strong adhesion, it is difficult to peel off the film with adhesive tape, so it cannot be measured.
The difficulty in quantitatively measuring film adhesion is that it is difficult to measure the force applied at the moment the film is peeled off. Existing peeling method adhesion measuring instruments are generally measured by modern means such as electromechanical sensors and computer signal acquisition. The instrument is not only complex in structure, inconvenient to operate, but also expensive, so it is difficult to popularize

Method used

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  • Measuring apparatus for thin-membrane adhesive force by stripping method
  • Measuring apparatus for thin-membrane adhesive force by stripping method
  • Measuring apparatus for thin-membrane adhesive force by stripping method

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Embodiment Construction

[0020] see first figure 1 , figure 1 It is a schematic diagram of the overall structure of the measuring device of the peeling method film adhesion of the present invention. It can be seen from the figure that the measuring device of the peeling method film adhesion of the present invention uses steel as the production material to avoid instrument errors caused by deformation in the measurement. The basic structure of the device is mainly composed of a measuring bracket 1 ( figure 2 , screw 4 ( image 3 ), nut 10 ( Figure 5 ), spring 7 ( Image 6 ) and measuring small anvil 8 ( Figure 7 )composition. Measuring bracket 1 is made by hollowing out the center of square steel, and there are openings on measuring bracket 1 The upper through hole 2 is formed, and the circular lower through hole 3 is provided at the same axial position as the upper through hole 2 on the lower side of the measuring support 1 . The cross section of screw rod 4 is also shape, see image 3 w...

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Abstract

A measuring device is composed of support, screw, nut spring and small measuring anvil. It is featured as setting special shape through hole and round through hole separately in top and bottom frame of support at the same axle, having round hole at bottom of screw, scale on vertical plane and division at round nut hole; passing anvil through bottom round hole and hooking two ends of spring to hole of anvil and hole of screw separately.

Description

technical field [0001] The invention relates to thin films, in particular to a measuring device for peeling-off thin film adhesion. technical background [0002] The adhesion of the film is the minimum force required to statically peel the film off the substrate. It is a physical quantity that characterizes the degree of adhesion between the film and the substrate. It is closely related to the durability, wear resistance and mechanical stability of the film. The size of the film adhesion is directly related to the service life of the film element. It is very important to focus on the size of the measurement. The peeling method is the most direct method for measuring the adhesion of a film. Now the tape peeling method is commonly used, which is to see the area of ​​the film peeled off by the tape by pulling the tape on the surface of the film. Obviously, this method is relatively rough, and can only qualitatively explain the size of the adhesion of the film, and cannot be u...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01N19/04
Inventor 张东平黄建兵齐红基赵元安张大伟邵建达范正修
Owner SHANGHAI INST OF OPTICS & FINE MECHANICS CHINESE ACAD OF SCI