Structure of flash memory and its operation method
An operation method and technology of flash memory, applied in the direction of electrical components, electric solid-state devices, circuits, etc., can solve the problems of low programming speed, asymmetric programming of memory cells, and low programming current, so as to reduce the current of memory cells and avoid Programming asymmetry, the effect of improving the operation speed
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[0052] figure 2 It is a top view of the flash memory of the present invention. Please refer to figure 2 The flash memory of the present invention is composed of a substrate 200, an element isolation structure 202, an active region 204, a control gate 206 (word line), a floating gate 208, an N-type source / drain region 210, and a P-type well region 312 with select gate 214. constituted. Wherein, an insulating layer (spacer) 216 and an insulating layer (spacer) 218 are disposed between the select gate 214 , the control gate 206 , and the floating gate 208 . A deep N-type well region (not shown) is disposed in the substrate 200 , and a P-type well region 212 is disposed on the deep N-type well region. The device isolation structure 202 is disposed in the substrate 200 to define the active region 204 so that the P-type well region 212 is only located in the active region 204 . The control gate 206 is disposed on the substrate 200 and perpendicular to the active region 204 ...
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