Substrate processing device

Abstract

The present invention relates to a substrate processing device, which can restrain a tact time from being increased due to maintenance. A plurality of slit nozzles 41a, 41b are arranged in the apparatus body 2 of this substrate treatment apparatus 1. A gap sensor 42a, lifting / lowering mechanisms 43a, 44a and movers 501a, 510a of linear motors 50, 51 are provided in the slit nozzle 41a. A gap sensor 42b, lifting lowering mechanisms 43b, 44b and movers 501b, 510b of the linear motors 50, 51 are provided in the slit nozzle 41b. When this substrate treatment apparatus 1 is operated, the slit nozzle 41b is maintained while the coating is performed by the slit nozzle 41a, and the slit nozzle 41a is maintained while the coating is performed by the slit nozzle 41b.

Description

technical field [0001] The present invention relates to a substrate processing apparatus capable of shortening the pause time by cleaning a slit nozzle without stopping the processing of a substrate. Background technique [0002] As an apparatus used in the manufacturing process of a substrate, a slit coater (substrate processing machine) that applies a resist liquid to a substrate by spraying a processing liquid such as a resist liquid onto the substrate surface from a slit nozzle is known. device). [0003] Conventionally, in order to improve the productivity in the manufacturing process of the substrate, it is desired to shorten the pause time of the substrate processing, and such a slit coater is described in Patent Document 1, for example. In the apparatus described in Patent Document 1, a technique is proposed in which a plurality of substrates are simultaneously processed by a plurality of slit nozzles to shorten the tact time. [0004] Patent Document 1 is Japanese...

AI Technical Summary

Problems solved by technology

However, for example, even if the slit coater is in operation, the slit nozzle cannot be used for maintenance of the slit nozzle, so the slit coater cannot perform coating processing on the substrate.

Therefore, if the maintenance is not completed within the time for carrying in and carrying out the substrates, there is a problem that the pause time of the substrate processing increases.

In particular, the process of removing the air accumulated inside the slit nozzle is a relatively time-consuming process, and there is a problem that it is difficult to complete the process within the time required for carrying in and out the substrate.

[0006] Even in the apparatus described in Patent Document 1, such a problem is not solved: when any one of the plurality of slit nozzles is being maintained, the substrates processed at other slit nozzles are correspondingly in a waiting process, thereby Increased downtime due to maintenance

[0007] Furthermore, in the slit coater described in Patent Document 1, there is such a problem that, for example, when an abnormality occurs in one slit nozzle and the slit nozzle needs to be extensively maintained, the entire slit coater must be stopped.

That is, as the number of slit nozzles increases, the chances of maintenance also increase. Therefore, in the slit coater described in Patent Document 1, there is also a problem that the intermittent time due to maintenance increases.

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