Method for assembling components

Abstract

A device mounting method capable of efficiently, accurately arraying micro-devices on a circuit board is provided. The method includes a device separating step of separating a plurality of LED chips, which have been arrayed with a specific period on a wafer, into individual LED chips while keeping the arrayed state of the LED chips as it is, a device re-arraying step of handling the individually separated LED chips so as to re-array the LED chips at intervals of a value equivalent to the period multiplied by a specific magnification, and a device transferring step of transferring the re-arrayed LED chips on a mounting board while keeping the re-arrayed state of the LED chips as it is.

Description

technical field [0001] The present invention relates to a device mounting method, in particular to the technology of mounting micro-semiconductor devices that have been cut from a wafer in a matrix array on a circuit board. An image display technology. Background technique [0002] Figure 11A is a perspective view showing an example of an image display used in a flat-panel television. As shown in the figure, a wiring portion 108 for external connection and a separate electrode 108a are formed on the surface of a circuit board (mounting board) 7 generally made of aluminum. Some wiring portions 108 serve as pad electrodes, and light emitting diodes (LED chips) are fixed on the pad electrodes by die bonding. [0003] Figure 11B yes Figure 11A A partial cross-sectional view of the image display shown. As shown in the figure, the surface of the circuit board is covered with black resin 123 except for the wiring portion 108 and the separation electrode 108a. The LED chip h...

AI Technical Summary

Problems solved by technology

However, the manufacture of such a plasma display has a problem of accurately arranging a large number of, say, several million individual microdevices such as LEDs with a size of about 20 μm×20 μm on a mounting board having a diagonal size of 50 inches, Based on the existing installation technology, it requires a lot of manpower and working time

To solve this problem, various methods have been proposed, however, any one method can only reach its practical level

For example, U.S. Patent No.5,783,856 and No.5,824,186 disclose a technology in which a large number of grooves are arranged on the mounting plate where chips are arranged, wherein the microchips are automatically moved in the grooves through the action of fluid movement. for installations; however, this approach is ineffective for installations where neither position nor orientation can be ignored

Japanese Patent Laid-Open Publication No. 56-17385 proposes a technology of repeated transfer of chips in order to transfer chips from the wafer side to the side of the mounting board, however, this document does not provide sufficient information for effectively arranging microchips on a large-sized mounting board. indicate any detailed method

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