Multi-layer circuit module with multi-layer ceramic substrate and embedded passive element

A technology of passive components and multi-layer circuits, which is applied in the manufacture of multi-layer circuits, including printed electrical components, circuits, etc., can solve the problems of not being able to significantly and effectively save the area or volume of passive components, and wasting the integrated area of ​​modules.
CN1356861AInactive Publication Date: 2002-07-03IND TECH RES INST

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
IND TECH RES INST
Publication Date
2002-07-03
Estimated Expiration
Not applicable · inactive patent

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Abstract

A multi-layer circuit module with multi-layer substrate and embedded passive elements features that the ICs are installed on one or two surfaces, the connecting lines are arranged in internal tracingarea, the basic passive elements (capacitor, resistor and inductor) are arranged in basic passive element area, the high-frequency elements (filter, coupler, and impedance converter) are arranged in high-frequency passive element area, grounded bayers are used for isolating element to prevent electromagnetic interference, and standard I / O pins are formed on the surface of bottom surface.
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Description

technical field

[0001] The present invention relates to a multi-layer circuit module (multi-layer circuit module), in particular, to a highly integrated multi-layer circuit module and a method for designing and integrating the circuit module. The circuit module is equipped with multi-layer ceramic substrate and embedded passive components. Background technique

[0002] figure 1 Describe the basic circuit architecture of a current wireless communication system. The basic components in this system include an RF front end circuit (RF front end circuit) 101, a modulation and demodulation module (modulation and demodulation module) 102, a base frequency control circuit (base band control circuit) 103 and a flash memory Module (flash memory module) 104 . Each basic component has a dedicated integrated circuit (integrated circuit) and peripheral components (peripheral device) to combine the required functions to meet the specifications required by the system. This system also i...

Claims

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