Multi-layer circuit module with multi-layer ceramic substrate and embedded passive element
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- IND TECH RES INST
- Publication Date
- 2002-07-03
- Estimated Expiration
- Not applicable · inactive patent
Smart Images
Figure 1 Figure 2 Figure 3
Abstract
Description
technical field
[0001] The present invention relates to a multi-layer circuit module (multi-layer circuit module), in particular, to a highly integrated multi-layer circuit module and a method for designing and integrating the circuit module. The circuit module is equipped with multi-layer ceramic substrate and embedded passive components. Background technique
[0002] figure 1 Describe the basic circuit architecture of a current wireless communication system. The basic components in this system include an RF front end circuit (RF front end circuit) 101, a modulation and demodulation module (modulation and demodulation module) 102, a base frequency control circuit (base band control circuit) 103 and a flash memory Module (flash memory module) 104 . Each basic component has a dedicated integrated circuit (integrated circuit) and peripheral components (peripheral device) to combine the required functions to meet the specifications required by the system. This system also i...