Chip pick-up device and producing method thereof and production apparatus of semiconductor

Abstract

The present invention relates to a chip pickup device capable of easily peeling off chips from a passivation layer without having to particularly adjust the push-up stroke of a pushing pin and the ascending / descending position of a supporting stage. The pushing pin 17 is protruded out of a pin hole 16. The pushing pin 17 is used to push a chip 102 via a passivation layer 101. The passivation layer 101 is sucked and drawn near the venting hole 15, but is not sucked and drawn near the pin hole 16. The passivation layer 101 is propped up at the vicinity of the pin hole 16 to be separated from the supporting stage 14, thereby peeling off the chip 102 from the passivation layer 101. Therefore, it is able to keep the stroke of the pushing pin 17 constant without modifying or adjusting the position of the supporting stage 14. In addition, because there is no absorbing force of air in the pin hole 16, it is easy to peel off the chip 102 from the passivation layer 101.

Description

field of invention [0001] The present invention relates to a chip pickup device, a manufacturing method thereof, and a semiconductor manufacturing device for supplying chips to electronic components and the like. Background technique [0002] Existing devices of this type include, for example, devices shown in Fig. 6(a) and (b). This device uses the needle 103 to pass through the paper 101 to push up the chips 102 of electronic components and the like pasted on the paper 101, so that the chip 102 is peeled off from the paper 101, and then absorbs and picks up the chip 102 with an opening clip (not shown). 102 is provided to the die-bonding head etc. of the die-bonding device. [0003] In addition, as shown in Fig. 7 (a) and (b), the paper 101 is covered on the inner cylindrical ring 111, and in the state where the paper 101 is spread out, the outer cylindrical ring 112 is fitted to the inner cylindrical ring. 111, the outer edge of the paper 101 is clamped to support it, a...

AI Technical Summary

Problems solved by technology

[0011] but, Figure 9 In the shown device, the pinholes 131b and the suction holes 131c are connected inside the stage 131, so the air is also sucked through the pinholes 131b, in fact as Figure 10 As shown, the paper 101 is in close contact with the front end of the needle 132, and there is a problem that the paper 101 is not stretched at the front end of the needle 132, and the chip 102 is not easy to peel off from the paper 101.

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