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Optical projection system, exposure device and method

A technology of projection optical system and optical surface, applied in the field of projection optical system, can solve the problems such as the height limitation of the clean room, the large effective diameter of the concave mirror, and the operational damage.

Inactive Publication Date: 2003-10-29
NIKON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, in the conventional projection optical system described in International Publication No. WO01 / 65285, the effective diameter of the concave mirror located in the catadioptric second imaging optical system constituting the protrusion is relatively large, so when vibrating, Mechanical stability is easily damaged
In addition, since the effective diameter of the lens arranged adjacent to the concave mirror becomes relatively large, when the lens is formed from fluorite, it is not easy to obtain and process a material having predetermined characteristics.
[0007] Moreover, in the conventional projection optical system, the distance between the object plane and the image plane (geometric distance) is relatively large, so the mechanical stability against vibration is easily damaged
However, when installed in an exposure device, the distance between the grating and the wafer becomes relatively large, so the operability is easily damaged, and it is easy to be limited by the height of the clean room
Also, when installed in an exposure device that utilizes exposure light below 200nm, for example, the relatively long projection light path will become filled with inert gas, which is unfavorable for the removal of inert gas
[0008] In addition, in the conventional projection optical system, the distance from the concave mirror in the catadioptric second imaging optical system constituting the protrusion to the reference optical axis (the optical axis of the first imaging optical system and the third imaging optical system) bigger
As a result, the mechanical stability is easily damaged in the face of vibration, and manufacturing errors are likely to occur at the time of assembling the second imaging optical system.
And when assembled in an exposure device that utilizes exposure light below 200nm, for example, the relatively long projection light path will become filled with inert gas, which is unfavorable for the removal of inert gas

Method used

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  • Optical projection system, exposure device and method
  • Optical projection system, exposure device and method
  • Optical projection system, exposure device and method

Examples

Experimental program
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no. 1 Embodiment

[0082] Figure 4 It is a figure which shows the lens structure of the projection optical system concerning the 1st Example of this embodiment. refer to Figure 4 , in the projection optical system PL related to the first embodiment, the first imaging optical system G1 is sequentially composed of a biconvex lens L11 from the grating side, a positive meniscus lens L12 with an aspherical concave surface facing the wafer side, and a convex surface facing the wafer side. Positive meniscus lens L13 on the grating side, positive meniscus lens L14 with the convex surface facing the grating side, negative meniscus lens L15 with the concave surface facing the grating side, positive meniscus lens L16 with the concave surface facing the grating side, aspheric shape The positive meniscus lens L17 with a concave surface facing the grating side, the positive meniscus lens L18 with a concave surface facing the grating side, the biconvex lens L19, and the positive meniscus lens L110 with an a...

no. 2 Embodiment

[0151] Image 6 It is a figure which shows the lens structure of the projection optical system concerning the 2nd Example of this embodiment. refer to Image 6 , in the projection optical system PL related to the second embodiment, the first imaging optical system G1 is sequentially composed of a biconvex lens L11 from the grating side, a positive meniscus lens L12 with an aspherical concave surface facing the wafer side, and a convex surface facing the wafer side. Positive meniscus lens L13 on the grating side, positive meniscus lens L14 with the convex surface facing the grating side, negative meniscus lens L15 with the concave surface facing the grating side, positive meniscus lens L16 with the concave surface facing the grating side, aspheric shape Positive meniscus lens L17 with concave surface facing the grating side, positive meniscus lens L18 with concave surface facing the grating side, positive meniscus lens L19 with convex surface facing the grating side, positive ...

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Abstract

The present invention provides a projection optical system which has a large image-side numerical aperture and a projection field of view, and has excellent mechanical stability in the face of vibration. Comprising the first imaging optical system (G1) for forming the first intermediate image of the first surface (R), the second imaging optical system for forming the second intermediate image based on the light beam emitted from the first intermediate image with a concave mirror (CM) (G2), a third imaging optical system (G3) for forming a final image on the second surface (W) based on the light beam emitted from the second intermediate image. Furthermore, the effective diameter (Ec) of the concave reflector, the distance (L) between the first surface and the second surface, and the distance (H) between the concave reflector and the reference optical axis (AX) satisfy predetermined conditional expressions.

Description

technical field [0001] The present invention relates to a projection optical system, an exposure device and an exposure method, in particular to a high-resolution catadioptric projection optical system, which is suitable for manufacturing semiconductor elements and liquid crystal display elements by photolithography Projection exposure equipment used in other times. Background technique [0002] In the photolithography process used to manufacture semiconductor elements, etc., a method is used to expose the image of the pattern on the photomask or grating (hereinafter collectively referred to as "grating") to a surface coated with photoresist, etc., through a projection optical system. A projection exposure device on a wafer (or glass sheet). On the other hand, as the degree of integration of semiconductor elements and the like increases, the resolving power (resolution) of the projection optical system of the projection exposure apparatus is required to be also increased. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B17/08G02B13/18G02B27/18G03B21/00G03F7/20H01L21/027
CPCG03F7/70275G03B21/006H01L21/027
Inventor 大村泰弘
Owner NIKON CORP
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