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Basic plate processing plant and cleaning method

A substrate processing device and substrate technology, applied in the field of cleaning, can solve problems such as inability to clean, cumbersome, difficult cleaning of the cover, etc.

Inactive Publication Date: 2004-06-16
TOKYO ELECTRON LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, from the viewpoint of increasing the size of glass substrates in recent years, there are problems such as safety when the spin chuck is made smaller.
When considering that the current spin chucks are generally the same size as the base plate, the cleaning of the cover becomes more and more difficult.
[0008] On the other hand, in the coating device shown in Patent Document 2, although a cover for closing the opening of the upper part of the cup is provided, it is necessary to install a cleaning jig on or from the rotary suction cup according to the cleaning situation of the cup. Loading and unloading, the workload increases and is cumbersome
Moreover, even if this cleaning jig is used in the device shown in Patent Document 1, it is not possible to clean the lid of the container.

Method used

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  • Basic plate processing plant and cleaning method
  • Basic plate processing plant and cleaning method
  • Basic plate processing plant and cleaning method

Examples

Experimental program
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Embodiment Construction

[0056] Embodiments of the present invention will be described below with reference to the drawings.

[0057] figure 1 To show a top view of a coating and developing treatment system for an LCD substrate to which the present invention is applied, figure 2 for its main view, image 3 for the rear view.

[0058] This coating and development processing system 1 includes: a cassette station 2 for placing a plurality of cassettes C for storing glass substrates G, and a plurality of cassettes for performing a series of processes including resist coating and development on the substrate G. The processing section 3 of the processing unit, and the interface section 4 for transferring the substrate G to and from the exposure device 32 , the cassette station 2 and the interface section 4 are respectively arranged at both ends of the processing section 3 .

[0059] The cassette station 2 includes a transport mechanism 10 for transporting the LCD substrate between the cassette C and th...

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Abstract

A rotary cup rotates at a predetermined rotational speed, so that a cleaning solution stored in a storage tank flows to the outside due to a centrifugal force. The cleaning solution is discharged upward as it is from a hole by the flowing force. Since the hole is diagonally formed, the cleaning solution is discharged in the diagonal direction. Thus, the cleaning solution can reach a region around the outer side of a substrate G in a lid body (a region on the right of a broken line indicated by reference character M).

Description

technical field [0001] The present invention relates to a substrate processing apparatus for coating and developing a resist, for example, on a glass substrate used in a liquid crystal display (LCD) or the like in a liquid crystal manufacturing process, and to a cleaning method used in such a substrate processing apparatus. Background technique [0002] In the LCD manufacturing process, in order to form an indium tin oxide thin film or an electrode pattern on a glass substrate for LCD, the same photolithography technology as used in the manufacturing of semiconductor devices is used. In photolithography, a photoresist is coated on a glass substrate, exposed to light, and then developed. [0003] In the photoresist coating process, for example, the substrate is housed in a rotating cup, the resist is supplied onto the substrate, the cup is covered, and the cup and the substrate are rotated integrally so that the resist is Diffused over the entire surface of the substrate to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02F1/13B08B3/00H01L21/00
CPCG02F1/1303
Inventor 山崎刚
Owner TOKYO ELECTRON LTD