Method for fabricating radiator and its structure
A manufacturing method and radiator technology, applied in the direction of heat exchange equipment, etc., can solve the problems of damage to the blade 22, shortening the service life of the tool 20, affecting the heat conduction effect of the heat dissipation fins and the bottom plate, etc.
Inactive Publication Date: 2004-08-25
SY THERMAL
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Problems solved by technology
It should be noted that, as shown in FIG. 2(B), when the tool 20 provides a greater external force to squeeze the land 118, and the plastic deformation of the land 118 increases, the extruded land 118 will be It cannot be completely drained to both sides of the groove 114, but will be pushed to the bottom of the groove 114, causing the cooling fins 120 to be pushed upwards to change its depth, and the bottom of the groove 114 is in contact with the cooling fins 120 There will be a gap 26 between them, which will affect the heat conduction effect between the cooling fins and the bottom plate
In addition, due to the increased impact force of the cutter 20, the blade edge 22 of the cutter 20 is relatively more damaged, which shortens the service life of the cutter 20
[0007] In order to solve the upward pushing effect of the above-mentioned cooling fins, in US Patent No. 5,638,715 (inventor Lipinski), it uses multiple rollers to squeeze the ridges on both sides of the groove, but the rollers cannot be inserted like a knife In the groove ridge, the plastic deformation of the groove ridge squeezed by the roller is not large enough, and the extrusion depth cannot reach the bottom of the groove, resulting in a decrease in the tightness between the bottom plate and the heat dissipation fins
Method used
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[0029] In order to make the above and other purposes, features and advantages of the present invention more comprehensible, a preferred embodiment is specifically cited below, together with the accompanying drawings, as follows:
[0030] Figure 3(A) to Figure 3(C) A schematic flowchart of a manufacturing method of a heat sink according to a preferred embodiment of the present invention is shown in sequence.
[0031] Please refer to Figure 3A The heat sink 200 is mainly composed of a bottom plate 210 and a plurality of heat dissipation fins 220, wherein the material of the bottom plate 210 is, for example, pure copper or copper alloy, and the material of the heat dissipation fins 220 is, for example, aluminum, copper and such alloys. composition. The bottom plate 210 has a plurality of grooves 214 and a plurality of recesses 216 , and the grooves 214 and the recesses 216 are alternately arranged on the top surface 212 of the bottom plate 210 , and the depths and widths of t...
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The present invention relates to a method for manufacturing heat radiator. Firstly, a base plate and several radiating fins are provided, said base plate has several grooves and several recessed holes, these recessed holes and grooves are alternatively arranged on one side of said base plate, and the heat-radiating fins are respectively arranged on the grooves. A compression die is inserted into the recessed hole so as to make the recessed hole be compressed and deformed, and make the adjacent groove be relatively compressed, so that the heat-radiating fin can be tightly inlaid in the groove.
Description
technical field [0001] The invention relates to a manufacturing method and structure of a radiator. Background technique [0002] In recent years, as the integration of internal circuits of integrated circuit (Integrated Circuit, IC) chips continues to increase, the heat dissipation performance of the heat dissipation system is also relatively required to be improved. Generally speaking, in electronic components such as the central processing unit, north bridge chip, and graphics chip of a personal computer, in order to quickly remove the IC chip of such electronic components when operating at high speed, the heat generated by it makes the IC chip operate at high speed. It can still maintain normal operation for a long time. The known technology is to use the heat sink (Heat Sink) to directly contact the surface of the electronic components to provide a larger heat dissipation area, and cooperate with the cooling airflow provided by the heat dissipation fan (fan) inside the ...
Claims
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Inventor 萧复元庄天赐
Owner SY THERMAL