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Waferized fiber optic connector

A technology of optical fiber connectors and contacts, applied in the direction of instruments, optics, light guides, etc., can solve the problems of occupying valuable space, increasing the size of the connection system and material costs

Inactive Publication Date: 2004-11-24
TERADYNE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] Second, due to the considerable mating forces that exist, prior art systems employ complex latch / release mechanisms, which tend to increase the size and material cost of the connection system
More importantly, this increased size of the connection system takes up valuable space on the printed circuit board that would otherwise be used by other components

Method used

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  • Waferized fiber optic connector
  • Waferized fiber optic connector
  • Waferized fiber optic connector

Examples

Experimental program
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Effect test

Embodiment Construction

[0033] figure 1 Three different configurations of fiber optic connection systems are shown. Options 1 and 3 are prior art constructions, and option 2 is the construction of the present invention. figure 1 Indicates the force that exists due to the use of a latch structure. The circles represent the extent of the force and how it is distributed within the system, while the arrows represent whether a forward force is applied to the baseplate after mating. It can be seen that the forward force applied to the base plate after mating is only present in the Option 1 configuration. Latch structures are shown in solid lines for easy identification.

[0034] Option 1 represents the prior art daughter card fiber optic connector, which is rigidly fixed to the backplane by an external cam latch structure or snap bolt installed in the package. This configuration is used, for example, in 3M's OGI backplane connectors. In this configuration, the force is distributed throughout the daugh...

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PUM

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Abstract

Generally, a fiber optic connector having at least one wafer, wherein the wafer holds at least one optical fiber, is provided. The wafer includes a retractable shroud, a body to receive the retractable shroud, and at least one biasing member. The biasing member is capable of being biased when the wafer contacts a corresponding mating wafer to cause the shroud to retract. In one specific detailed perspective and embodiment of the invention, the wafer as stated further includes the retractable shroud having a door that preferably opens outwardly and at least one ferrule that holds the optical fiber, where the ferrule is provided with an alignment pin. The biasing member includes a first biasing member, a second biasing member and a third biasing member. The first biasing member is capable of being biased to cause the alignment pin of the ferrule to open the door of the retractable shroud. The second biasing member is capable of being biased to cause the retractable shroud to be received by the body. And the third biasing member is capable of being biased to cause the retractable shroud and the body to accommodate variable wipe length.

Description

[0001] Cross References to Related Applications [0002] This application calls for a submission dated August 31, 2001 entitled "Connector Design Accommodating Variable Wipe Length While Minimizing Potential Optical Fiber Misalignment" ”) of U.S. Provisional Application No. 60 / 316,594. Background technique [0003] Traditional high-speed computer and communication systems are often built using backplane components. Such systems are built on printed circuit boards ("PCBs"), called "daughter boards" or "daughter cards," which are interconnected through a backplane. [0004] A traditional backplane is a printed circuit board with many signal traces on it. The traces carry signals between electrical connectors mounted on the surface of the chassis. The daughter cards have mating electrical connectors along one edge thereof, allowing each daughter card to be inserted into the backplane. In this configuration, the daughter cards are mounted parallel to each other and usually per...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/36G02B6/38
CPCG02B6/3897G02B6/3821G02B6/3879G02B6/3885G02B6/3849G02B6/3882G02B6/3878G02B6/3893G02B6/38
Inventor 塞佩赫·基亚尼理查德·F·罗思
Owner TERADYNE