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Plasma display

A plasma display and distance technology, applied in the direction of solid cathode components, cold cathode tubes, etc., can solve the problems of fixed power cables, thin thickness, and small heat conduction area, so as to improve operating efficiency and heat dissipation efficiency.

Inactive Publication Date: 2010-05-12
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Although the electronic components 242 and the driving module 220 are additionally arranged on the second circuit board 250 in this structure, since the second circuit board 250 is arranged on the rear cover 40, the driving circuit supplied to the second circuit board 250 cannot be provided in advance during assembly. The power cable of the drive module 220 is fixed, and then the rear cover 40 is covered; in addition, although the contact between the drive module 220 and the frame 230 can conduct the heat generated by the drive module 220 out, there is no soft heat-conducting material between the metal contacts Filling, and there are no fixing devices such as screws around to make the two tightly connected, which will cause the heat conduction area to become smaller and the heat conduction to deteriorate
In addition, because the rear cover 40 is easily deformed due to its large area and thin thickness, the frame 230 is only attached to the rear cover 40 by the thermal conductor 270, and there will be a problem of reducing the heat conduction area due to poor bonding strength.

Method used

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Examples

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no. 1 example

[0027] Such as image 3 As shown, a first circuit board 350 and a second circuit board 300 are arranged in the accommodation space formed by the metal rear cover 40 and the substrate 30, and the second circuit board 300 is fixed to the substrate by a plurality of spacer columns 361. 30, and the first circuit board 350 is fixed on the second circuit board 300 by a plurality of spacer columns 362, thereby keeping an appropriate distance between the first circuit board 350 and the second circuit board 300 so as to facilitate the second circuit board 300 The second circuit board 300 is equipped with an electronic component (second electronic component) 340, and a spacer column 363 is provided between the first circuit board 350 and the rear cover 40 to keep an appropriate distance between the first circuit board 350 and the rear cover 40. In order to carry the driver module 320 (first electronic component) on the first circuit board 350; since the driver module 320 has a larger he...

no. 2 example

[0032] Such as Figure 4 As shown, according to the structure of the first embodiment, if the space between the first circuit board 350 and the second circuit board 300 is large enough, electronic components (fifth electronic components) with a smaller height can be mounted on the back side of the first circuit board 350. Component) 380, the rest of the structure is the same as the first embodiment. In this way, the number of mounted electronic components can be increased.

no. 3 example

[0034] Such as Figure 5 As shown, the circuit board 500 is affixed to the substrate 30 by spacers 560, and the drive module 520 and electronic components 540 are mounted on the circuit board 500, wherein the drive module 520 can be connected to the rear cover 40 by the copper heat-conducting shrapnel 570. The thermal contact is made so that the heat generated by the driving module 520 can be conducted to the rear cover 40 through the heat conducting shrapnel 570 , and the large area of ​​the rear cover 40 improves the heat dissipation efficiency. In addition, the heat-conducting elastic sheet 570 is composed of an elastic portion 571 and a contact portion 572 , which can be integrally formed. The elastic portion 571 is in the shape of a ㄩ, and can be opened to both sides to provide elastic deformation; the contact portion 572 is a flat plate structure, and the elastic portion 571 is deformed to generate a restoring force that closely abuts against the rear cover 40 . The arr...

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PUM

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Abstract

A plasma indicator includes a first CB and a second CB set in the containing space formed by a baseboard and a back-cover plate, the first CB is fixed on the baseboard and the second is fixed on the first CB. A first electronic component is carried on the first CB, and a second component with different heating powers to that of the first is carried on the second CB, a heat conduction device is designed between the second component and the back-cover plate to transfer the heat and radiate it, so that, electronic components with different heat powers can be carried on different CB so as to enable them have individual radiation spaces to increase the radiation efficiency.

Description

technical field [0001] The invention relates to a plasma display, in particular to a plasma display device which separates individual heat dissipation spaces for electronic components with different heat generation. Background technique [0002] The main heat sources of the plasma display are the display panel, the electronic components on the driving circuit and the driving module. In the construction of existing plasma displays, such as figure 1 As shown, the display panel 10 of the plasma display is bonded and fixed on the metal substrate 30 by the thermal pad 20, and the substrate 30 is combined with the rear cover plate 40 of the plasma display to form a closed space for accommodating the circuit board 100 and the driving module 120. Both the electronic components 140 are mounted on the circuit board 100 . Therefore, the heat generated by the display panel 10 can be conducted to the metal rear cover 40 through the thermal pad 20 and the substrate 30 to dissipate, and ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01J17/49H01J17/28
Inventor 林裕凯
Owner AU OPTRONICS CORP
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