Producing device and its producing method for capillary tissue micro groove of heat pipe inner wall

Abstract

The device for making the micro capillary grooves in the inner wall of heat pipe mainly consists of positioning rod, cutter and pull rod. The positioning rod is mounted on one side surface of the pull rod, and the cutter is mounted on the other side surface of the pull rod. The present invention also relates to the method of making the micro capillary grooves in the inner wall of heat pipe with the said device. The making process features that the pull rod is drawn axially to drive the cutter to broach in the inner wall of the heat pipe base and the inner wall surface of the heat pipe base cracks to form capillary micro grooves. The improved capillary structure makes the heat pipe possess excellent heat transferring performance and lowers the production cost of heat pipe.

Description

technical field [0001] The invention relates to a manufacturing device of a heat transfer element of an electronic device, in particular to a manufacturing device of capillary microgrooves on the inner wall of a heat pipe. [0002] The invention also relates to a method for manufacturing the capillary micro-grooves on the inner wall of the heat pipe. Background technique [0003] At present, electronic products tend to be more high-performance, multi-functional, and lighter, especially electronic computer products. With the continuous improvement of the integration of electronic chips, the accumulated energy per square inch will continue to increase according to Moore's law, bringing fatal High heat flux, if the accumulated heat cannot be discharged in time, it will lead to serious failure of electronic devices, thus restricting the further development and application of electronic products. [0004] Conventional heat sink technology for electronic...

AI Technical Summary

Problems solved by technology

The capillary metal powder sintered structure is not only expensive, but also complex in process, and adds extra weight to the heat pipe, especially after the capillary structure is sintered, the mandrel is easy to damage the sintered powder structure when it is drawn out, resulting in a decline in the performance of the heat pipe; for small thin-walled The heat pipe is extremely inconvenient to operate when the metal braided wire mesh is embedded in the tube. Moreover, the metal braided mesh is not in close contact with the inner wall of the heat pipe, which leads to an increase in its radial thermal resistance and affects the heat transfer performance. Moreover, the existence of the central support structure, It also increases the extra weight of the heat pipe, which increases the pressure on the chip and even damages the chip

[0005] For the problems existing in the capillary structure of the heat pipe and its high manufacturing cost, it is necessary to find a suitable capillary structure and reduce its production cost without affecting the heat transfer performance of the heat pipe, so as to promote the popularization of heat pipes. application

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