Manufacturing system and method for semiconductor device

A device manufacturing method and manufacturing system technology, applied in the field of manufacturing device control, simulation device, and simulation of semiconductor device manufacturing process, can solve problems such as increasing wafer inspection processes, troublesome additional production planning work, and prolonging the manufacturing period of semiconductor devices

Inactive Publication Date: 2005-03-16
KK TOSHIBA
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

For this reason, it is necessary to adjust the production plan of semiconductor devices and the number of orders of users, and frequently repeat troublesome additional production planning work, which increases the number of wafer inspection processes and prolongs the manufacturing period of semiconductor devices.

Method used

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  • Manufacturing system and method for semiconductor device
  • Manufacturing system and method for semiconductor device
  • Manufacturing system and method for semiconductor device

Examples

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no. 8 example

[0155] The semiconductor device manufacturing system of the eighth embodiment of the present invention is as Figure 8 As shown, there is: a processing device 14a for processing a wafer 17a; a processing device 14b for processing a wafer 17b; a processing device 14c for processing a wafer 17c; a processing device 14d for processing a wafer 17d; Devices 5a-5d; databases 13a-13d respectively located in respective diagnostic devices 5a-5d; inspecting devices 19a-19d for inspecting wafers 17a-17d respectively; connected with self-diagnosing devices 5a-5d to receive processing devices 14a-14d A computer 11 of estimated mass values ​​for each of the processed wafers 17a-17d.

[0156] The self-diagnostic means 5a-5d used in the eighth embodiment can be constituted by the same hardware resources as the self-diagnosed system 11a used in the first embodiment and software working in conjunction therewith. In this way, the self-diagnosing devices 5a-5d serving as the self-diagnosing syst...

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Abstract

The present invention provides a solution for interleaving data frames, in a semiconductor device manufacturing system in which the processing apparatus for conducting a process on any one of a semiconductor substrate and a thin film on a surface thereof; a self-diagnostic system for diagnosing a state of the processing apparatus; and a parameter fitting apparatus for maintaining a parameter of the self-diagnostic system when an inspection result of the semiconductor substrate having undergone the process has been determined to be correct, and for changing the parameter of the self-diagnostic system when the inspection result has been determined to be incorrect.

Description

technical field [0001] The present invention relates to a semiconductor device manufacturing system and a semiconductor device manufacturing method, in particular to a manufacturing device control method, and a semiconductor device manufacturing process simulation method and simulation device using the device and the method. Background technique [0002] Conventionally, semiconductor devices such as DRAMs have been manufactured by using semiconductor manufacturing equipment to repeatedly form substrate steps, form wells, insulate, form transistors, form bit lines, form capacitors, and form wiring. This semiconductor manufacturing process is performed by photolithography treatment, etching treatment, heat treatment (oxidation, annealing, diffusion), ion implantation treatment, or film formation treatment (CVD, sputtering, evaporation), cleaning treatment (resist removal, It consists of a proper combination of solution cleaning) and inspection processing. [0003] In general,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/02H01L21/00
CPCG05B19/41875H01L21/67253H01L21/67276H01L22/26H01L22/30
Inventor 牛久幸广柿沼英则秋山龙雄首藤俊次安部正泰小松茂
Owner KK TOSHIBA
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