Forming article, forming method, forming device and surface treating method for formed article
A technology of forming products and planes, which is used in extrusion forming devices, forming devices, forming products obtained by extrusion forming, and surface treatment of formed products, which can solve the problems of reducing the strength of the substrate and achieve the effect of simple process
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Embodiment 1
[0047] use Figure 1-8 The molding apparatus and molding method related to Embodiment 1 of the present invention will be described. figure 1 It is a block diagram showing a schematic configuration of the molding apparatus 100 related to the first embodiment. This molding device 100 is an extrusion molding device for extrusion molding a molded product. For example, a preformed molded product such as injection molding or extrusion molding is placed in a metal mold of the extrusion device and extruded to deform or reshape its shape in part or in its entirety.
[0048] In the figure, 17A-17C are decompression valves, 18A-18F are check valves, and 7A-7E are air-driven automatic on-off valves. In this example 1 use CO 2 As a supercritical fluid, but the type of supercritical fluid is not limited to this, it can be air, CO, CO 2 , O 2 , N 2 、H 2 Any of O, methane, ethane, propane, butane, pentane, hexane, methanol, ethanol, acetone, and diethyl ether. CO 2 The supercritical...
Embodiment 2
[0073] Same as Example 1, make the supercritical CO containing metal complex and entrainer 2 Circulates and stays in the passage 32. Then, in order to efficiently remove the ligands of the metal complex, the temperature of the upper and lower metal molds 24 and 36 is heated to 160° C. by the heater 26 for ten minutes. Next, the heater 26 was turned off, and the upper and lower molds were cooled to 130° C., and then the pressure in the passage 32 was reduced. Simultaneously with the pressure reduction in the passage 32, the extrusion pressure is also released. As a result, the surrounding atmosphere of a specific portion of the molded product 29 corresponding to the passage 32 is also in a decompressed state, and the inside of the portion is foamed.
[0074] The larger the pressure difference when the supercritical fluid is vaporized, that is, the faster the decompression, the smaller and more foam cells will be. In addition, it is preferable that the resin temperature at th...
Embodiment 3
[0077] Same as in Example 2, after the passage 32 is opened to the atmosphere, in order to efficiently remove the ligands of the metal complex, the temperature of the upper and lower metal molds 24, 36 is heated to 160° C. by the heater 26 for ten minutes. Subsequently, supercritical N at 45°C and 15 MPa was introduced from an inlet not shown in the figure. 2. Next, the heater 26 was turned off, and the upper and lower molds were cooled to 130° C., and then the pressure in the passage 32 was reduced. While depressurizing, release the extrusion pressure. As a result, the surrounding atmosphere of a specific portion of the molded product 29 corresponding to the passage 32 is also in a decompressed state, and the inside of the portion is foamed.
[0078] Thereafter, the molded product 29 is taken out and subjected to electroless copper plating to obtain a good copper wiring pattern. In the molded product 29 in Example 2, foaming was observed inside the convex portion 29a. The...
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Abstract
Description
Claims
Application Information
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